Tin (Sn) Evaporation Wire 99.999% Dia. 2.0 mm ATOMFAIR®

Price range: $180.00 through $1,100.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade Tin (Sn) evaporation wire, 99.999% pure and 2.0 mm dia., for thermal/resistive deposition in W/Mo/Ta sources; 25g-1kg packs.

Tin (Sn) Evaporation Material, Wire, 99.999%, Dia. 2.0 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
Product Overview

Tin (Sn) Evaporation Material, Wire, 99.999%, Dia. 2.0 mm is a research-grade pure metal evaporation material supplied as Wire with 99.999% material specification and Wire Dia. 2.0 mm size range for vacuum thin-film deposition workflows.

This evaporation material is prepared for laboratory procurement where material identity, purity, physical form, pack size and deposition hardware must be confirmed before ordering. The listed configuration supports selection for Thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat.

Available pack sizes are 25g / 100g / 500g / 1kg. Buyers should confirm deposition source geometry, required quantity, certificate requirements and shipment conditions before quotation.

Performance Features
  • Defined material identity: Tin (Sn) for clear procurement and deposition-process matching.
  • Specified physical form: Wire with Wire Dia. 2.0 mm sizing to support source loading and evaporation review.
  • Purity or composition listed as 99.999%, allowing comparison between standard, high-purity and RFQ-controlled grades.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-SNWIR-5N2P0MM
Material Tin
Formula Sn
Product Type Pure Metal Evaporation Material
Form Wire
Purity / Composition 99.999%
Particle Size / Dimensions Wire Dia. 2.0 mm
Minimum Order Quantity 25g
Available Pack Sizes 25g / 100g / 500g / 1kg
Indicative Price Tiers 25g: USD 180; 100g: USD 350; 500g: USD 850; 1kg: USD 1100
Evaporation Source W/Mo/Ta filament, basket, coil, or boat
Evaporation Method Thermal/resistive evaporation
Melting Point 232
Density 7.28
Z-Ratio 0.724
PROCUREMENT CHECK: Confirm model, purity, form, size range, pack size and deposition-source compatibility before quotation.
DOCUMENTATION REVIEW: Certificate, safety data sheet, shipment condition and export requirements can be reviewed against laboratory use requirements.
APPLICATION MATCHING: Evaporation source hardware and process route should be matched to material behavior, melting point and film requirements.
INQUIRY NOTE: Include the required model, purity, form, size range and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This evaporation material is designed for thermal/resistive deposition under vacuum using W/Mo/Ta filament, basket, coil, or boat sources. Deposition source geometry, process route, and melting point (232°C) must be matched to the material's wire form (2.0 mm diameter) and purity grade (99.999%) to achieve required film properties.

  • Source Compatibility: The material is intended for thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat sources.
  • Deposition Source Geometry: Deposition source geometry must be confirmed to accommodate the 2.0 mm wire diameter before ordering.
  • Process Parameter Matching: Evaporation process parameters must be matched to the material's melting point (232°C) and film requirements.
  • Purity Consideration: The 99.999% purity level is specified for high-purity thin-film deposition applications.

How does the Z-ratio of 0.724 for Tin (Sn) affect thickness monitoring during thermal evaporation?

The Z-ratio of 0.724 is a material-specific acoustic impedance factor used to calibrate quartz crystal microbalance (QCM) thickness monitors when depositing Tin. It corrects the frequency-to-thickness conversion for the acoustic mismatch between the quartz crystal and the deposited Tin film, ensuring accurate real-time thickness measurement. This value is explicitly provided in the product specifications for process setup.

What filament or boat materials are compatible with evaporating 99.999% Tin wire?

The product specification lists tungsten (W), molybdenum (Mo), and tantalum (Ta) as compatible evaporation source materials for filament, basket, coil, or boat configurations. These refractory metals withstand the required evaporation temperature above the melting point of 232°C without reacting with molten Tin. Users should confirm that the source geometry accommodates the 2.0 mm wire diameter.

What handling and storage conditions are recommended for 99.999% Tin wire to maintain purity before deposition?

The product description advises reviewing the certificate of analysis and safety data sheet for specific handling recommendations. As a high-purity (99.999%) metal, it should be stored in a clean, dry environment to prevent surface oxidation or contamination. The wire form is supplied ready for use, and the melting point of 232°C and density of 7.28 g/cm³ are provided for process planning.

Tin (Sn) evaporation material in wire form (99.999% purity, 2.0 mm diameter) is suited for thermal resistive evaporation using common refractory metal sources. The low melting point (232°C) and Z-ratio of 0.724 require careful process calibration and thermal management, while the high purity minimizes contamination in thin-film applications.

Positive

  • High Purity (99.999%): The 5N purity grade reduces trace metal contamination in deposited films, critical for electronic and optical thin-film applications.
  • Compatible Wire Form: Wire diameter of 2.0 mm is compatible with standard thermal evaporation sources (W/Mo/Ta filament, basket, coil, or boat), facilitating direct loading.

Trade-offs

  • Low Melting Point: The melting point of 232°C is relatively low, requiring careful temperature control to avoid rapid evaporation or source wetting, and may limit use in certain high-temperature processes.
  • Z-Ratio Calibration Requirement: A Z-ratio of 0.724 necessitates recalibration of quartz crystal microbalance monitors for accurate film thickness control during deposition.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

25g, 100g, 500g, 1kg

Related Products