Silicon Nitride Ceramic Substrate, 114 mm x 114 mm x 0.35 mmProduct Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What is the fracture toughness of the Atomfair 114 mm x 114 mm x 0.35 mm silicon nitride ceramic substrate and how does it contribute to mechanical reliability?
The fracture toughness is 6.5 MPa√m, and the flexural strength exceeds 600 MPa. These combined properties provide high resistance to crack propagation and mechanical stress, ensuring stable shape retention under demanding conditions.
Can this silicon nitride substrate be used for applications requiring both high electrical insulation and high thermal conductivity at elevated temperatures?
Yes. The substrate offers a breakdown voltage greater than 15 kV/mm and thermal conductivity above 60 W/(m·K), with a usable temperature range from -55°C to 850°C, making it suitable for demanding thermal management and insulation applications.
What surface finish and customization options are available for this silicon nitride ceramic substrate?
The substrate can be supplied with specified surface finish, and options include polishing, coating, metallization, or custom shapes such as tubes, rods, and plates. Size tolerance, thickness, material grade, and package format must be confirmed before order.
This 114 x 114 x 0.35 mm silicon nitride ceramic substrate offers a flexural strength exceeding 600 MPa and thermal conductivity above 60 W/(m·K), suitable for high-stress, high-thermal-load applications where electrical insulation (>15 kV/mm breakdown voltage) is required. The usable temperature range of -55°C to 850°C and good fracture toughness (6.5 MPa·√m) provide operational stability in thermal cycling environments.
Positive
- High flexural strength and toughness: Flexural strength >600 MPa and fracture toughness of 6.5 MPa·√m provide mechanical robustness against cracking and deformation under mechanical or thermal stress.
- Broad thermal operating range: Usable from -55°C to 850°C, enabling deployment in cryogenic to high-temperature environments without sacrificing structural integrity or electrical insulation.
Trade-offs
- Thin substrate handling fragility: At 0.35 mm thickness, the substrate is mechanically robust yet thin; careful handling is required during integration to avoid edge chipping or breakage under local point loads.
- Custom processing dependencies: Polishing, coating, metallization, or custom shaping are not included as standard and must be separately specified, requiring coordination with the supplier and potentially affecting lead times.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
