Silicon Nitride Ceramic Substrate 100×100×3 mm ATOMFAIR®

$81.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade silicon nitride ceramic substrate, 100 mm x 100 mm x 3 mm, >600 MPa flexural strength, >60 W/(m·K), -55 °C to 850 °C. Order now.

Silicon Nitride Ceramic Substrate, 100 mm x 100 mm x 3 mm

Product Type: Technical ceramic substrate
Research-grade laboratory product

Product Overview

Silicon nitride ceramic substrate provides high flexural strength above 600 MPa, high fracture toughness, insulation, and thermal conductivity above 60 W/(m?K) for demanding ceramic substrate applications.

This selected specification is listed as an independent ceramic substrate item for procurement by exact size and thickness.

Performance Features

  • High mechanical stress resistance with stable shape retention.
  • High strength, high thermal conductivity, high insulation, and corrosion resistance.
  • Usable temperature range from -55 ?C to 850 ?C.
  • Can be produced as tubes, rods, plates, sheets, and custom-shaped ceramic parts.

Technical Specifications

Parameter Specification / Available Values
Atomfair Model AF-SIN-S100P300
Product type Technical ceramic substrate
Material silicon nitride ceramic
Selected specification 100 mm x 100 mm x 3 mm
Apparent density =3.22 g/cm?
Flexural strength >600 MPa
Young modulus >310 GPa
Vickers hardness >15 GPa
Fracture toughness 6.5 MPa?vm
Thermal conductivity >60 W/(m?K)
Use temperature -55 ?C to 850 ?C
Breakdown voltage >15 kV/mm
QUOTATION DETAILS: Confirm AF-SIN-S100P300, 100 mm x 100 mm x 3 mm, and required quantity before quotation.
CONFIGURATION CONFIRMATION: Verify size tolerance, thickness requirement, material grade, surface finish, and package format for this silicon nitride ceramic substrate.
OPTION MATCHING: Confirm polishing, coating, metallization, or custom-shape needs when they are required for the application.
REQUEST DETAILS: Include the exact size, thickness, color or package detail, and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR?

What is the fracture toughness of this silicon nitride substrate and how does it resist crack propagation under mechanical stress?

The silicon nitride substrate has a fracture toughness of 6.5 MPa√m, which provides high resistance to crack propagation under mechanical stress. Combined with flexural strength above 600 MPa and Vickers hardness above 15 GPa, this substrate is designed for demanding applications requiring shape retention and durability.

Can this silicon nitride substrate be customized with metallization or coating for direct bonding in power electronics assemblies?

Yes, the manufacturer supports optional customization including polishing, coating, metallization, and custom-shape fabrication. These options must be confirmed with the technical sales team before ordering to ensure compatibility with the specific application, such as power module substrates or LED packaging.

What is the maximum operating temperature and thermal conductivity of this substrate, and what are the implications for high-temperature applications?

The usable temperature range is -55°C to 850°C, with thermal conductivity exceeding 60 W/(m·K). This allows reliable operation in high-temperature environments while efficiently dissipating heat. The substrate also maintains electrical insulation with a breakdown voltage above 15 kV/mm, making it suitable for high-voltage, high-temperature assemblies.

This 100 mm × 100 mm × 3 mm silicon nitride ceramic substrate delivers flexural strength >600 MPa, fracture toughness 6.5 MPa·√m, and thermal conductivity >60 W/(m·K), making it suitable for high-stress, high-temperature insulation applications up to 850 °C, though its brittle nature and tight dimensional verification requirements impose handling and procurement constraints.

Positive

  • High strength and fracture toughness: Flexural strength >600 MPa and fracture toughness 6.5 MPa·√m provide mechanical stress resistance and stable shape retention, enabling use in structural or insulating supports under load.
  • Wide operating temperature range: Usable from -55 °C to 850 °C with thermal conductivity >60 W/(m·K) and breakdown voltage >15 kV/mm, allowing deployment in high-temperature electrical insulation or thermal management systems.

Trade-offs

  • Brittle ceramic handling risk: Silicon nitride ceramics are inherently brittle; despite high fracture toughness, the substrate can chip or crack under localized impact or improper clamping, requiring careful handling during installation or machining.
  • Dimensional verification required: The supplier mandates confirmation of size tolerance, thickness, surface finish, and material grade before ordering, adding a verification step to procurement and potentially limiting direct replacement without exact specification matching.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).