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Sapphire Substrate – 6 inch (150 mm) R-Plane Double-Side Polished
Product Type: Sapphire substrate
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sapphire substrate features epi-ready double-side polished surfaces with Ra <0.3 nm, requiring contamination-free handling to maintain surface quality. The wafer geometry tolerances (TTV <10 um, BOW <15 um, WARP <20 um) must be preserved through careful storage and transport.
- Surface Cleanliness: The epi-ready surface must be kept free of particles and contaminants to preserve the specified roughness.
- Geometric Tolerance: The stringent TTV, BOW, and WARP specifications require gentle handling and proper support to avoid deformation.
How does the choice of thickness (500 µm vs 1000 µm vs 1300 µm) affect thermal management and mechanical stability for R-plane sapphire substrates in high-temperature growth processes?
The standard thickness is 1000 ±25 µm, but optional 500 µm and 1300 µm are available. Thinner substrates reduce thermal resistance, which may improve heat transfer in high-temperature processes, but they also increase the risk of warpage and fragility. Thicker substrates provide greater mechanical stability, benefiting from the product's specified <15 µm BOW and <20 µm WARP limits for the standard thickness. The exact trade-offs for alternative thicknesses should be verified with the manufacturer.
What is the significance of the A-plane 47.5 mm primary flat orientation for R-plane sapphire substrates in device fabrication?
The A-plane 47.5 mm primary flat provides a crystallographic alignment reference for R-plane oriented substrates, enabling precise orientation during photolithography, dicing, and other device processing steps. R-plane sapphire is commonly used for heterogeneous epitaxy (e.g., GaN) due to reduced lattice mismatch, and the flat orientation ensures consistent wafer-to-wafer alignment critical for reproducible device performance.
What storage and handling requirements are necessary to maintain the double-side polished epi-ready surface roughness (Ra <0.3 nm) on these sapphire substrates?
To preserve the epi-ready surface roughness (Ra <0.3 nm on both front and back sides), the substrates must be stored in a clean, dry, and particle-free environment. Handling should be performed using cleanroom gloves and vacuum tweezers to avoid contamination or mechanical damage. The product is supplied as 1 piece/set, and additional cleaning prior to use may be required depending on the application.
This 6-inch R-Plane sapphire substrate features double-side polished epi-ready surfaces with <0.3 nm roughness and >99.99% purity, suitable for advanced epitaxial growth. The 1000±25 µm thickness and single-wafer packaging are key considerations for process integration.
Positive
- High-purity monocrystalline Al2O3 (>99.99%): Supplied as KY-grown monocrystalline Al2O3 with >99.99% purity, ensuring minimal contamination for epitaxial thin film deposition.
- Double-side polished epi-ready surfaces: Both front and back sides achieve Ra <0.3 nm, providing immediate readiness for epitaxial growth without additional surface preparation.
Trade-offs
- Thickness tolerance of ±25 µm: The standard 1000±25 µm thickness may require individual measurement and sorting for processes demanding tighter thickness uniformity, such as multi-wafer batch deposition.
- Single-wafer packaging per set: Each order contains one piece per set, which may necessitate ordering multiple units to achieve adequate wafer counts for multi-wafer processing runs.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
