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Sapphire Substrate – 6 inch (150 mm) C-Plane Single-Side Polished
Product Type: Sapphire substrate
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the front-side and back-side roughness specifications for the 6-inch C-plane single-side polished sapphire substrate?
The front-side roughness is epi-ready with Ra < 0.3 nm, and the back-side roughness is fine ground with Ra < 1.2 μm, as specified in the product datasheet. This distinction ensures optimal surface quality for subsequent epitaxial growth while maintaining mechanical strength.
What are the TTV, BOW, and WARP tolerances for the 6-inch sapphire substrate and why are they important for photolithography?
The total thickness variation (TTV) is < 10 μm, bow is < 15 μm, and warp is < 20 μm. These tight tolerances are critical for uniform photoresist coating and precise alignment during photolithography, reducing pattern distortion across the wafer.
What is the primary flat orientation on this sapphire substrate and how does it affect wafer alignment?
The primary flat is on the A-plane with a 47.5 mm length (or the substrate can be supplied with a notch). This flat provides a reference for crystallographic orientation during device processing, ensuring consistent alignment of epitaxial layers and masks.
This 6-inch C-plane sapphire substrate (Atomfair AF-SAP-C6SSP) provides high-purity monocrystalline Al2O3 (>99.99%) with an epi-ready front surface (Ra <0.3 nm) and tight geometric tolerances (TTV <10 um, BOW <15 um, WARP <20 um), making it well-suited for epitaxial thin-film deposition. The single-side polished finish and back-side fine ground roughness (Ra <1.2 um) require careful consideration for double-sided or optical applications.
Positive
- High-purity monocrystalline Al2O3: >99.99% purity ensures consistent material properties for epitaxial growth and device fabrication.
- Epi-ready front-side surface: Front-side roughness Ra <0.3 nm enables direct use for thin-film deposition without additional polishing.
Trade-offs
- Single-side polish only: Back-side is fine ground with Ra <1.2 um, limiting compatibility with double-sided processing or optical applications requiring both sides polished.
- Thickness tolerance ±25 µm: Standard thickness of 1000 ±25 µm may require tighter selection for processes demanding sub-micron thickness uniformity.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
