Sapphire Substrate 2 in A-Plane SSP 430μm ATOMFAIR®

$32.90

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

2 in (50.8 mm) A-plane sapphire substrate, >99.99% Al2O3, 430 ±25 μm thick with SSP, Ra <0.3 nm front side and <10 μm TTV/BOW/WARP. Order now.

SKU: AF-WF-S-SAPH-02IN-S011
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Sapphire Substrate – 2 inch (50.8 mm) A-Plane Single-Side Polished
Product Type: Sapphire substrate
Research-grade laboratory product
Product Overview

2 inch (50.8 mm) sapphire substrate in A-Plane orientation is supplied as high-purity monocrystalline Al2O3 (KY) with 430 +/- 25 um standard thickness and single-side polished surface preparation.

The wafer geometry includes A-plane 16 mm primary flat or notch configuration, <10 um TTV, <10 um BOW and <10 um WARP for product comparison.

Performance Features
  • High-purity monocrystalline sapphire material with >99.99% purity.
  • Single-Side Polished surface preparation with roughness values differentiated by front and back side.
  • Diameter-specific thickness, primary flat or notch, TTV, BOW and WARP values are presented for specification review.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-SAP-A2SSP
Material >99.99% high-purity monocrystalline Al2O3 (KY)
Orientation A-Plane
Diameter 2 inch (50.8 mm)
Standard Thickness 430 +/- 25 um
Optional Thickness 200 um, 400 um, 1000 um
Primary Flat / Notch A-plane 16 mm
Polishing Single-Side Polished
Front-Side Roughness Epi-ready, Ra <0.3 nm
Back-Side Roughness Fine ground, Ra <1.2 um
TTV <10 um
BOW <10 um
WARP <10 um
Package 1 piece/set
Selected Specification: Select 2 inch (50.8 mm), A-Plane, Single-Side Polished and preferred thickness option.
Packaging Details: Package 1 piece/set with available cleaning or packing preferences for this sapphire substrate.
Ordering Details: Share the selected model, configuration, quantity and any thickness or packaging preference.
PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Why does this sapphire substrate have different surface roughness specifications for the front side (Ra <0.3 nm) and back side (Ra <1.2 um)?

The front side is epi-ready polished to Ra <0.3 nm to provide an atomically smooth surface for high-quality epitaxial deposition, while the back side is fine ground to Ra <1.2 um to improve handling durability and reduce the risk of chipping or breakage during processing.

What is the purpose of the A-plane 16 mm primary flat on this 2-inch sapphire substrate?

The primary flat indicates the A-plane crystallographic orientation and serves as a mechanical alignment reference for wafer handling, photolithography, and dicing. The 16 mm width is the standard notch-compatible flat dimension for 2-inch (50.8 mm) wafers, ensuring compatibility with industry-standard cassettes and aligners.

What do TTV, BOW, and WARP specifications of <10 um mean for this substrate's performance?

TTV (total thickness variation), BOW, and WARP all under 10 um indicate extremely tight geometric tolerances, which are critical for uniform epitaxial growth, photolithography depth-of-focus control, and wafer bonding yield. These specifications ensure the substrate meets the flatness requirements of advanced thin-film deposition and micro-fabrication processes.

This 2-inch A-Plane sapphire substrate offers >99.99% purity monocrystalline Al2O3 with an epi-ready front surface (Ra <0.3 nm) and tight geometric tolerances (TTV, BOW, WARP <10 µm), making it suitable for epitaxial film growth and high-resolution optical applications, though the single-side polished finish limits back-side optical use.

Positive

  • High-purity monocrystalline Al2O3: >99.99% purity ensures minimal defect density and contamination for demanding research and device fabrication.
  • Epi-ready front surface finish: Front-side roughness Ra <0.3 nm meets epitaxial growth requirements, enabling high-quality thin-film deposition.

Trade-offs

  • Single-side polished limitation: Back-side is fine ground (Ra <1.2 µm), not suitable for double-sided optical or transmission applications without additional polishing.
  • Standard thickness tolerance ±25 µm: The 430 µm standard thickness has a ±25 µm tolerance, which may require screening for applications needing precise thickness uniformity.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).