96% Alumina Ceramic Substrate, 35 mm x 35 mm x 1 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What dielectric and thermal properties does the 96% alumina ceramic substrate provide for power or RF insulation applications?
The substrate is specified with a 96% Al2O3 dense ceramic body, low dielectric constant and dielectric loss, and a useful thermal conductivity greater than 24 W/(m·K). It also provides a breakdown voltage of at least 15 kV/mm, allowing it to function as an electrically insulating carrier while still conducting heat.
What mechanical and surface specifications should be verified before metallizing or coating this 35 mm x 35 mm x 1 mm alumina substrate?
The substrate has a surface roughness of Ra 0.15-0.30 µm, flexural strength greater than 350 MPa, Vickers hardness of 14 GPa, and density at least 3.70 g/cm³. Before polishing, coating, metallization, or custom shaping, the supplier asks you to confirm size tolerance, thickness requirement, material grade, surface finish, and package format.
Which ordering details must be confirmed to receive the correct AF-A96-S035P100 96% alumina substrate?
Confirm the Atomfair model AF-A96-S035P100, the selected 35 mm x 35 mm x 1 mm specification, pack of 50, and required quantity before quotation. Also verify size tolerance, thickness, material grade, surface finish, package format, and any polishing, coating, metallization, or custom-shape needs.
This 96% alumina ceramic substrate in 35 mm x 35 mm x 1 mm size provides a dense, high-strength platform for laboratory applications requiring electrical insulation, thermal management, and chemical stability, with a flexural strength exceeding 350 MPa and thermal conductivity above 24 W/(m·K).
Positive
- High mechanical and electrical performance: Flexural strength >350 MPa and breakdown voltage ≥15 kV/mm enable structural integrity under load and reliable electrical isolation in high-voltage setups.
- Balanced thermal and dielectric properties: Thermal conductivity >24 W/(m·K) supports moderate heat spreading while low dielectric constant and loss minimize signal interference in RF or precision instrumentation.
Trade-offs
- Surface roughness requires verification: As-sintered surface roughness of Ra 0.15–0.30 μm may necessitate polishing or finishing for applications requiring low-friction or precise thin-film adhesion.
- Post-processing dependencies for customization: Custom polishing, coating, metallization, or shaping must be arranged separately; the substrate is supplied in standard sintered condition without additional surface treatments.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).






