C-Plane Sapphire Substrate 2 inch 430μm SSP ATOMFAIR®

$13.90

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

>99.99% C-plane monocrystalline Al2O3 sapphire substrate, 2 inch SSP wafer with 430 ±25 μm thickness, Ra <0.3 nm front surface. TTV <10 μm. Order now.

SKU: AF-WF-S-SAPH-02IN-S001
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Sapphire Substrate – 2 inch (50.8 mm) C-Plane Single-Side Polished
Product Type: Sapphire substrate
Research-grade laboratory product
Product Overview

2 inch (50.8 mm) sapphire substrate in C-Plane orientation is supplied as high-purity monocrystalline Al2O3 (KY) with 430 +/- 25 um standard thickness and single-side polished surface preparation.

The wafer geometry includes A-plane 16 mm primary flat or notch configuration, <10 um TTV, <10 um BOW and <10 um WARP for product comparison.

Performance Features
  • High-purity monocrystalline sapphire material with >99.99% purity.
  • Single-Side Polished surface preparation with roughness values differentiated by front and back side.
  • Diameter-specific thickness, primary flat or notch, TTV, BOW and WARP values are presented for specification review.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-SAP-C2SSP
Material >99.99% high-purity monocrystalline Al2O3 (KY)
Orientation C-Plane
Diameter 2 inch (50.8 mm)
Standard Thickness 430 +/- 25 um
Optional Thickness 200 um, 400 um, 1000 um
Primary Flat / Notch A-plane 16 mm
Polishing Single-Side Polished
Front-Side Roughness Epi-ready, Ra <0.3 nm
Back-Side Roughness Fine ground, Ra <1.2 um
TTV <10 um
BOW <10 um
WARP <10 um
Package 1 piece/set
Selected Specification: Select 2 inch (50.8 mm), C-Plane, Single-Side Polished and preferred thickness option.
Packaging Details: Package 1 piece/set with available cleaning or packing preferences for this sapphire substrate.
Ordering Details: Share the selected model, configuration, quantity and any thickness or packaging preference.
PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Why is this 2-inch C-plane sapphire substrate single-side polished instead of double-side polished?

Single-side polishing reduces cost and processing time while maintaining the required epi-ready front surface (Ra <0.3 nm) for epitaxial deposition. The back side is fine ground to Ra <1.2 μm, which provides sufficient mechanical stability and handling durability without the expense of a second polish.

What is the purpose of the A-plane 16 mm primary flat on this sapphire substrate?

The A-plane 16 mm primary flat indicates the crystallographic orientation and is used for wafer alignment during photolithography, deposition, and other processing steps. This flat ensures consistent orientation across wafers in automated equipment, which is critical for device fabrication.

How should the epi-ready front surface of this substrate be handled to avoid damage?

The front surface has a roughness of Ra <0.3 nm (epi-ready) and must be protected from scratches, particles, and contamination. Use cleanroom gloves, vacuum tweezers, and a clean storage container. The back side, with fine ground finish (Ra <1.2 μm), is more robust and can be handled with less caution.

This 2-inch C-plane sapphire substrate provides >99.99% high-purity monocrystalline Al2O3 with an epi-ready front-side roughness (Ra <0.3 nm) and tight geometric tolerances (TTV, BOW, WARP <10 μm), making it suitable for epitaxial growth. The single-side polished surface limits back-side finish to fine ground (Ra <1.2 μm), which may require additional processing for double-side applications.

Positive

  • High-purity monocrystalline Al2O3: Material purity >99.99% ensures minimal contamination for sensitive epitaxial and device fabrication processes.
  • Epi-ready front-side surface: Front-side roughness Ra <0.3 nm meets epi-ready standards, enabling direct use for thin-film deposition without additional polishing.

Trade-offs

  • Single-side polished back surface: Back side is fine ground with Ra <1.2 μm, not polished; applications requiring double-side polish or optical back-side quality will need additional processing.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).