|
Off-Cut Sapphire Substrate – 2 inch (50.8 mm) M/C off-cut 1 degree Single-Side Polished
Product Type: Off-cut sapphire substrate
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||
|
PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
How do the TTV, BOW, and WARP specifications of the 2-inch off-cut sapphire substrate influence thin-film deposition uniformity?
The substrate features TTV <10 um, BOW <15 um, and WARP <15 um, ensuring minimal thickness variation, bowing, and warping across the wafer. These tight tolerances are critical for maintaining consistent film thickness during deposition processes such as CVD or sputtering, directly impacting yield and performance.
What are the front-side and back-side surface roughness specifications on this single-side polished sapphire substrate?
The front-side is polished to epi-ready roughness Ra <0.3 nm, suitable for epitaxial growth. The back-side is fine ground to Ra <1.2 um, providing a durable surface for handling and mounting without damaging the polished front side.
What thickness options are available for this off-cut sapphire substrate, and does it come with packaging details?
The standard thickness is 430 +/- 25 um, but custom thicknesses can be ordered. The substrate is packaged 1 piece per set, with the package size following the selected configuration.
This 2-inch off-cut sapphire substrate with 1 degree M/C off-cut and single-side polished epi-ready surface (Ra <0.3 nm) provides tight geometry tolerances (TTV <10 um, BOW/WARP <15 um) for high-purity monocrystalline Al2O3 (KY) in research-grade epitaxial growth applications.
Positive
- High-purity monocrystalline Al2O3: >99.99% purity (KY) provides reliable crystal quality for thin-film deposition and epitaxy.
- Tight geometry tolerances: TTV <10 um, BOW and WARP <15 um ensure substrate flatness for uniform processing in lithography and bonding.
Trade-offs
- Single-side polished only: Back-side is fine ground (Ra <1.2 um); not suitable for applications requiring double-side polished surfaces without additional processing.
- Fixed off-cut angle: Only 1 degree M/C off-cut is available for this SKU; other off-cut angles require different product selection.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).



