Nickel-Plated Copper Foil 0.5-2μm AF-CUNI-0U5-2U ATOMFAIR®

$349.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Continuous nickel-plated copper foil with ≥99.0% nickel, 0.5-2 μm plating, ≤30 milliohm surface resistance and 5B adhesion at room temperature. Order now.

Continuous Nickel-Plated Copper Foil

Product Type: Nickel-plated copper foil

Research-grade laboratory product

Product Overview

Continuous nickel-plated copper foil is a plated conductive foil material with nickel layer thickness available from 0.5 to 2 μm according to customer requirements.

The plated layer is described as uniform and fine, with good bonding, corrosion resistance, oxidation resistance and low surface resistance.

Performance Features

Nickel purity is specified at ≥99.0% and measured at ≥99.5%.
Nickel plating thickness can be produced from 0.5 to 2 μm.
Double 85 testing for 24 hours is marked OK.
Cross-cut adhesion is 5B and measured surface resistance is 10 milliohm.

Technical Specifications

Parameter	Specification / Available Values
Atomfair Model	AF-CUNI-0U5-2U
Nickel purity	Specification ≥99.0%; measured ≥99.5%
Plating thickness	0.5-2 μm available according to customer requirement
Double 85 test	OK for 24 hours
Cross-cut adhesion test	5B
Surface resistance	Specification ≤30 milliohm; measured 10 milliohm
Surface dyne value	Specification ≥38; measured 40
Alcohol rubbing	OK at 500 g
Corrosion resistance	OK at room temperature, 5% NaCl, pH 7 for 12 hours

Quotation Confirmation: Confirm base copper foil and required nickel layer thickness.

Specification Confirmation: Confirm double 85, corrosion-resistance and surface-resistance requirements.

Configuration Support: Nickel plating thickness is customized within the listed 0.5-2 μm range.

Quotation Note: Include base foil, nickel thickness and quantity for quotation support.

LABORATORY PROCUREMENT SUPPORT

For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.

E-MAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

This nickel-plated copper foil is designed for use as a current collector in battery and electronic applications. The foil must be stored in a dry, ambient environment to prevent oxidation and maintain surface properties.

Humidity and Temperature Tolerance: The foil withstands 85°C and 85% relative humidity for 24 hours without delamination or surface degradation.
Corrosion Resistance: The foil resists corrosion in 5% sodium chloride solution at neutral pH and room temperature for 12 hours.
Solvent Resistance: The foil surface withstands alcohol rubbing under a 500-gram load without damage.
Adhesion Quality: The nickel plating exhibits a cross-cut adhesion rating of 5B, indicating no peeling or flaking.
Surface Energy: The foil surface energy is at least 38 dynes/cm, ensuring adequate wettability for coatings.

FAQ

What is the measured surface resistance of Atomfair's continuous nickel-plated copper foil, and how does it compare to the specification?

The measured surface resistance is 10 milliohm, well below the specification of ≤30 milliohm. This low resistance is achieved through uniform, fine nickel plating with a measured purity ≥99.5%.

What customization options are available for the nickel plating thickness, and how does this affect performance?

Nickel plating thickness can be customized from 0.5 to 2 μm. The product's Double 85 test (85°C/85% RH) passes for 24 hours, and corrosion resistance is verified at 5% NaCl, pH 7 for 12 hours, regardless of thickness within this range.

What adhesion and durability tests does this nickel-plated copper foil pass?

The foil achieves a cross-cut adhesion rating of 5B, indicating no peeling. It also passes alcohol rubbing at 500 g force, confirming robust nickel layer bonding suitable for electrode processing.

Assessment

Continuous nickel-plated copper foil with measured nickel purity ≥99.5%, surface resistance of 10 milliohm, and cross-cut adhesion 5B. Requires specification of nickel plating thickness (0.5–2 μm) and confirmation of test requirements for corrosion and environmental resistance.

Positive

High nickel purity: Nickel purity specification is ≥99.0% and measured at ≥99.5%, ensuring reliable electrochemical performance and reduced contamination in sensitive applications.
Excellent adhesion and low resistance: Cross-cut adhesion rated 5B (perfect adhesion) combined with a measured surface resistance of 10 milliohm, well below the ≤30 milliohm specification, minimizing ohmic losses in current collectors.

Trade-offs

Requires custom thickness specification: Nickel plating thickness is customized within the 0.5–2 μm range and must be confirmed at order time, adding a specification step for buyers requiring standardized off-the-shelf inventory.
Limited corrosion test conditions: Corrosion resistance is validated only at room temperature in 5% NaCl at pH 7 for 12 hours; performance under elevated temperatures, acidic or alkaline environments, or longer durations is not demonstrated.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.