Tin-Plated Copper Foil 1-5 μm Research Grade ATOMFAIR®

$459.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade continuous tin-plated copper foil with 1-5 μm tin layer, ≥99.0% purity, ≤30 mΩ surface resistance, and 5B adhesion. Order now.

Continuous Tin-Plated Copper Foil

Product Type: Tin-plated copper foil

Research-grade laboratory product

Product Overview

Continuous tin-plated copper foil is a plated conductive foil material with tin layer thickness available from 1 to 5 μm according to customer requirements.

The tin layer protects the copper substrate from oxidation and supports reflow soldering performance while maintaining low surface resistance.

Performance Features

Tin purity is specified at ≥99.0% and measured at ≥99.5%.
Tin plating thickness can be produced from 1 to 5 μm.
Reflow solderability, cross-cut adhesion and alcohol rubbing are marked OK or 5B.
Copper can be tin-plated directly or plated with a nickel underlayer before tin plating.

Technical Specifications

Parameter	Specification / Available Values
Atomfair Model	AF-CUTN-1U5U
Tin purity	Specification ≥99.0%; measured ≥99.5%
Plating thickness	1-5 μm available according to customer requirement
Reflow solderability	OK
Cross-cut adhesion test	5B
Surface resistance	Specification ≤30 milliohm; measured 10 milliohm
Surface dyne value	Specification ≥38; measured 40
Alcohol rubbing	OK at 500 g
Corrosion resistance	OK at room temperature, 5% NaCl, pH 7 for 12 hours

Selection and Configuration

Plating route	Direct tin plating on copper or nickel underlayer before tin plating
Tin layer thickness	1-5 μm

Quotation Confirmation: Confirm base copper foil and required tin layer thickness.

Specification Confirmation: Confirm whether direct tin plating or nickel-underlayer tin plating is required.

Configuration Support: Reflow solderability and corrosion-resistance requirements should be confirmed with layer design.

Quotation Note: Include base foil, plating route, tin thickness and quantity for quotation support.

LABORATORY PROCUREMENT SUPPORT

For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.

E-MAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

What is the surface resistance of the continuous tin-plated copper foil and how does it compare to specification?

The surface resistance is specified at ≤30 milliohm and measured at 10 milliohm, indicating excellent conductivity. This low resistance supports efficient current flow in battery or electronic applications.

Is it necessary to use a nickel underlayer when plating tin on copper for this foil?

No, it is not necessary. The foil can be produced with direct tin plating on copper or with a nickel underlayer before tin plating. The choice depends on specific reflow solderability and corrosion-resistance requirements, which should be confirmed with layer design.

What is the corrosion resistance of this tin-plated copper foil under saline conditions?

The foil passes corrosion resistance testing at room temperature in 5% NaCl solution at pH 7 for 12 hours. This ensures suitability for environments where salt exposure may occur, but extended or harsher conditions should be evaluated.

Assessment

This continuous tin-plated copper foil provides a conductive substrate with high tin purity (≥99.5% measured) and low surface resistance (10 milliohm), suitable for research-grade applications requiring reliable solderability and corrosion resistance under mild conditions.

Positive

High tin purity and low surface resistance: Tin purity ≥99.0% (measured ≥99.5%) combined with surface resistance ≤30 milliohm (measured 10 milliohm) ensures minimal electrical losses and reliable contact in sensitive applications.
Robust adhesion and solderability: Cross-cut adhesion test result of 5B and reflow solderability OK indicate excellent mechanical bonding and reliable solder joint formation, critical for assembly processes.

Trade-offs

Limited corrosion test conditions: Corrosion resistance verified only at room temperature, 5% NaCl, pH 7 for 12 hours; performance under extended exposure, elevated temperature, or acidic/alkaline conditions is not specified.
Thickness restricted to 5 μm maximum: Tin plating thickness available only up to 5 μm, which may be insufficient for applications requiring thicker plating for enhanced wear resistance or high-current handling.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.