96% Alumina Ceramic Substrate, 120 mm x 120 mm x 0.63 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What dielectric and thermal performance does the Atomfair 96% alumina substrate provide?
The AF-A96-S120P063 96% Al2O3 substrate is specified with a breakdown voltage of 15 kV/mm, low dielectric constant and dielectric loss, and thermal conductivity greater than 24 W/(m·K). These properties, together with high mechanical strength and corrosion resistance, support electrically insulating and heat-dissipating technical ceramic applications.
What surface finish and mechanical strength can be expected from this 120 mm × 120 mm × 0.63 mm 96% alumina substrate?
This 96% Al2O3 substrate has a white dense ceramic appearance, surface roughness Ra 0.15–0.30 µm, flexural strength greater than 350 MPa, Vickers hardness of 14 GPa, and density of 3.70 g/cm³. The selected format is 120 mm × 120 mm × 0.63 mm, packaged as 10 pieces.
What configuration details must be confirmed before ordering this 96% alumina substrate for custom processing?
Before ordering, confirm polishing, coating, metallization, or custom-shape needs when they are required, and verify size tolerance, thickness requirement, material grade, surface finish, and package format. For this item, quotation should reference model AF-A96-S120P063, 120 mm × 120 mm × 0.63 mm, pack of 10, with the required quantity.
This 96% alumina ceramic substrate (120 mm x 120 mm x 0.63 mm, pack of 10) offers a balance of high flexural strength (>350 MPa), electrical insulation (breakdown voltage ≥15 kV/mm), and moderate thermal conductivity (>24 W/(m·K)), making it suitable for thin-film or thick-film circuit carrier applications where mechanical robustness and dielectric performance are required.
Positive
- High mechanical and dielectric strength: Flexural strength >350 MPa and breakdown voltage ≥15 kV/mm provide robust structural integrity and reliable electrical isolation under moderate bias conditions.
- Consistent surface finish for processing: Surface roughness Ra 0.15–0.30 μm supports uniform metallization adhesion and minimizes signal loss in high-frequency circuit layouts.
Trade-offs
- Moderate thermal conductivity limits heat dissipation: With thermal conductivity >24 W/(m·K), this 96% alumina substrate provides lower heat spreading than beryllia or aluminum nitride, requiring thermal management design for high-power devices.
- Post-processing required for custom patterns: Delivery as a plain ceramic plate—no integrated metallization, polishing, or coating—necessitates additional fabrication steps before use in functional circuits.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
