Aluminum Nitride Ceramic Substrate 50×50×1 mm ATOMFAIR®

$25.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade aluminum nitride ceramic substrate, 50×50×1 mm pack of 10, with >170 W/(m·K) thermal conductivity and 15 kV/mm DC breakdown. Order now.

Aluminum Nitride Ceramic Substrate, 50 mm x 50 mm x 1 mm, Pack of 10

Product Type: Technical ceramic substrate
Research-grade laboratory product

Product Overview

Aluminum nitride ceramic substrate provides high thermal conductivity above 170 W/(m?K), reliable insulation, low dielectric loss, and dimensional stability for electronic and electrical heat-dissipation applications.

This selected specification is supplied as an independent ceramic substrate item for buyers who need a defined size, thickness, and package configuration.

Performance Features

  • Thermal conductivity is about 7-10 times higher than alumina ceramic.
  • Low dielectric constant and low dielectric loss support insulating substrate use.
  • Thermal expansion is close to silicon for power module and electronic component workflows.
  • Non-toxic ceramic material with high-temperature and chemical corrosion resistance.

Technical Specifications

Parameter Specification / Available Values
Atomfair Model AF-ALN-S050P100
Product type Technical ceramic substrate
Material aluminum nitride ceramic
Selected specification 50 mm x 50 mm x 1 mm, Pack of 10
Surface roughness Ra 0.2-0.3 ?m
Density =3.3 g/cm?
Flexural strength >400 MPa
Fracture toughness 3.0 MPa?vm
Vickers hardness 11 GPa
Young modulus 320 GPa
Thermal conductivity, 25 ?C >170 W/(m?K)
Breakdown voltage, DC =15 kV/mm
QUOTATION DETAILS: Confirm AF-ALN-S050P100, 50 mm x 50 mm x 1 mm, Pack of 10, and required quantity before quotation.
CONFIGURATION CONFIRMATION: Verify size tolerance, thickness requirement, material grade, surface finish, and package format for this aluminum nitride ceramic substrate.
OPTION MATCHING: Confirm polishing, coating, metallization, or custom-shape needs when they are required for the application.
REQUEST DETAILS: Include the exact size, thickness, color or package detail, and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR?

Verify size tolerance, thickness requirement, material grade, surface finish, and package format before integrating this substrate. Confirm that the substrate's thermal expansion behavior is compatible with the intended adjacent materials in the power module or electronic component assembly.

  • Pre-integration verification: Verify size tolerance, thickness requirement, material grade, surface finish, and package format before integration.
  • Thermal expansion compatibility: Confirm that the thermal expansion behavior of the substrate is compatible with the intended adjacent materials in the power module or electronic component assembly.
  • Service environment confirmation: Confirm that the intended operating environment is within the substrate's stated high-temperature and chemical corrosion resistance limits.
  • Optional finishing confirmation: Confirm whether polishing, coating, metallization, or custom-shape processing is required before use.

Why use an aluminum nitride ceramic substrate instead of alumina for power module heat dissipation?

AlN is specified for applications requiring high heat dissipation with electrical insulation. This substrate has thermal conductivity above 170 W/(m·K) at 25 °C, which the product description states is about 7–10 times higher than alumina ceramic, while retaining low dielectric constant and low dielectric loss for insulating-substrate use.

Is this AlN substrate thermally compatible with silicon for power module or electronic component assembly?

Yes. The product description states that the thermal expansion of the aluminum nitride ceramic is close to silicon, which supports power module and electronic component workflows. It also specifies a flexural strength above 400 MPa and a Young's modulus of 320 GPa as relevant mechanical properties for substrate mounting and assembly.

What electrical and surface specifications should be verified before using this 50 mm x 50 mm x 1 mm AlN substrate?

Verify the specified DC breakdown voltage of at least 15 kV/mm, surface roughness Ra of 0.2–0.3 µm, and the exact 50 mm x 50 mm x 1 mm format. The description also lists density ≥3.3 g/cm³, fracture toughness 3.0 MPa·√m, and Vickers hardness 11 GPa, which are relevant to substrate handling and mechanical design.

This aluminum nitride ceramic substrate (50 mm x 50 mm x 1 mm, pack of 10) offers thermal conductivity exceeding 170 W/(m·K), approximately 7-10 times that of alumina, while maintaining a coefficient of thermal expansion close to silicon, making it suitable for power module and electronic component heat-dissipation applications; however, its as-fired surface roughness of 0.2-0.3 μm and brittle ceramic nature require careful handling and may necessitate additional polishing or metallization for certain workflows.

Positive

  • High thermal conductivity for heat dissipation: Thermal conductivity >170 W/(m·K) at 25 °C, roughly 7-10 times higher than alumina ceramic, enabling efficient heat spreading in power electronics and LED substrates.
  • CTE matched to silicon: Thermal expansion coefficient close to silicon reduces thermomechanical stress in power module and electronic component assemblies.

Trade-offs

  • Surface roughness may require post-processing: As-fired surface roughness Ra of 0.2-0.3 μm may necessitate polishing or coating for applications requiring smooth metallization or high-precision bonding.
  • Brittle ceramic requires careful handling: With flexural strength >400 MPa but fracture toughness of 3.0 MPa·√m, the substrate is susceptible to chipping or cracking if improperly handled during cutting, mounting, or thermal cycling.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).