Aluminum Nitride Ceramic Substrate, 120 mm x 120 mm x 1 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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How does the thermal conductivity of this aluminum nitride substrate compare to alumina, and what specific value is guaranteed at 25 °C?
This aluminum nitride ceramic substrate provides thermal conductivity approximately 7–10 times higher than alumina ceramic, with a guaranteed value above 170 W/(m·K) at 25 °C. This high thermal conductivity, combined with a thermal expansion coefficient close to silicon, makes it suitable for power module and electronic component heat-dissipation applications.
What are the key mechanical and electrical specifications that affect integration into power module or electronic workflows?
The substrate offers a flexural strength >400 MPa, fracture toughness of 3.0 MPa·√m, Vickers hardness of 11 GPa, and Young's modulus of 320 GPa. Electrically, it provides a DC breakdown voltage ≥15 kV/mm, low dielectric constant, and low dielectric loss, supporting reliable insulation in high-voltage and high-frequency environments.
What surface roughness and dimensional tolerances should be verified before integrating this substrate into a metallization or bonding process?
The substrate has a surface roughness Ra of 0.2–0.3 µm, which is critical for adhesion in metallization or direct bonding processes. Buyers must confirm size tolerance, thickness requirement, material grade, and surface finish with the supplier, as the product is supplied as an independent ceramic substrate without pre-applied coatings or metallization.
The aluminum nitride ceramic substrate (120 mm x 120 mm x 1 mm, pack of 10) delivers a thermal conductivity exceeding 170 W/(m·K), roughly 7–10 times that of alumina, with a coefficient of thermal expansion matched to silicon. Its use requires careful verification of size tolerances, thickness, surface finish, and optional metallization or coating prior to application, as these parameters directly affect bond-line integrity and dielectric performance in power module assembly.
Positive
- High thermal conductivity relative to alumina: Thermal conductivity above 170 W/(m·K) at 25 °C, approximately 7–10 times higher than alumina ceramic, enabling efficient heat spreading in power electronics and LED substrates.
- CTE matched to silicon: Thermal expansion coefficient close to that of silicon reduces thermo-mechanical stress during thermal cycling, improving reliability in direct-bonded substrate assemblies for semiconductor modules.
Trade-offs
- Requires verification of physical tolerances: Size tolerance, thickness, surface finish, and material grade must be confirmed before ordering; undocumented variations may affect fit and bond-line uniformity in precision assemblies.
- Optional processing needed for integration: Polishing, coating, metallization, or custom shaping are not included by default and must be specified separately, adding lead time and cost for applications requiring direct attach or patterned conductors.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
