Aluminum Nitride Ceramic Substrate 0.63 mm ATOMFAIR®

$34.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade AlN ceramic substrate, 120 mm × 120 mm × 0.63 mm, pack of 10, with >170 W/(m·K) thermal conductivity and ≥15 kV/mm DC breakdown. Order now.

Aluminum Nitride Ceramic Substrate, 120 mm x 120 mm x 0.63 mm, Pack of 10

Product Type: Technical ceramic substrate

Research-grade laboratory product

Product Overview

Aluminum nitride ceramic substrate provides high thermal conductivity above 170 W/(m?K), reliable insulation, low dielectric loss, and dimensional stability for electronic and electrical heat-dissipation applications.

This selected specification is supplied as an independent ceramic substrate item for buyers who need a defined size, thickness, and package configuration.

Performance Features

Thermal conductivity is about 7-10 times higher than alumina ceramic.
Low dielectric constant and low dielectric loss support insulating substrate use.
Thermal expansion is close to silicon for power module and electronic component workflows.
Non-toxic ceramic material with high-temperature and chemical corrosion resistance.

Technical Specifications

Parameter	Specification / Available Values
Atomfair Model	AF-ALN-S120P063
Product type	Technical ceramic substrate
Material	aluminum nitride ceramic
Selected specification	120 mm x 120 mm x 0.63 mm, Pack of 10
Surface roughness Ra	0.2-0.3 ?m
Density	=3.3 g/cm?
Flexural strength	>400 MPa
Fracture toughness	3.0 MPa?vm
Vickers hardness	11 GPa
Young modulus	320 GPa
Thermal conductivity, 25 ?C	>170 W/(m?K)
Breakdown voltage, DC	=15 kV/mm

QUOTATION DETAILS: Confirm AF-ALN-S120P063, 120 mm x 120 mm x 0.63 mm, Pack of 10, and required quantity before quotation.

CONFIGURATION CONFIRMATION: Verify size tolerance, thickness requirement, material grade, surface finish, and package format for this aluminum nitride ceramic substrate.

OPTION MATCHING: Confirm polishing, coating, metallization, or custom-shape needs when they are required for the application.

REQUEST DETAILS: Include the exact size, thickness, color or package detail, and quantity when requesting quotation support.

LABORATORY PROCUREMENT SUPPORT

For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.

E-MAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR?

How does the thermal conductivity of this aluminum nitride substrate compare with alumina ceramic?

It is about 7-10 times higher than alumina ceramic. The datasheet specifies thermal conductivity above 170 W/(m·K) at 25 °C, which supports heat-dissipation and insulating substrate applications.

Why is this AlN substrate suited for power module and electronic component workflows?

Its thermal expansion is close to silicon, reducing thermal mismatch risk in power module and electronic component workflows. It also combines thermal conductivity above 170 W/(m·K) at 25 °C, low dielectric constant, low dielectric loss, and a DC breakdown voltage of ≥15 kV/mm.

What mechanical and surface specifications should be evaluated before handling or processing this ceramic substrate?

The substrate has surface roughness Ra 0.2-0.3 µm, flexural strength >400 MPa, fracture toughness 3.0 MPa·√m, Vickers hardness 11 GPa, Young modulus 320 GPa, and density ≥3.3 g/cm³. Confirm size tolerance, thickness, material grade, surface finish, and package format, and request polishing, coating, metallization, or custom-shape specifications if required for the application.

Assessment

This 120 mm x 120 mm x 0.63 mm aluminum nitride ceramic substrate (SKU: AF-MA-C-ALNT-S120-P063) provides a thermal conductivity above 170 W/(m·K) at 25 °C, roughly 7–10 times higher than alumina, with a coefficient of thermal expansion close to silicon, making it suitable for power module and high-density electronic heat dissipation applications that require electrical insulation and dimensional stability.

Positive

High thermal conductivity for heat dissipation: Thermal conductivity above 170 W/(m·K) at 25 °C, approximately 7-10 times greater than alumina ceramic, enabling efficient heat spreading in power electronics and high-power LED assemblies.
Thermal expansion matched to silicon: Coefficient of thermal expansion close to silicon reduces thermomechanical stress during thermal cycling, improving reliability in direct-bonded substrate and power module packaging.

Trade-offs

Surface roughness requires verification: Surface roughness Ra is specified at 0.2–0.3 μm; applications requiring ultra-smooth surfaces for thin-film metallization or direct bonding may need to confirm this tolerance with the supplier.
Custom finishing and metallization needed separately: The product is supplied as a bare ceramic substrate; polishing, coating, or metallization layers are not included and must be specified during quotation, adding lead time and process steps.

Quality Standards & Performance Verification

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Shipping & Returns

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).