96% Alumina Ceramic Substrate, 125 mm x 125 mm x 3 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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How does the 96% alumina content of this substrate balance dielectric performance and mechanical strength for high-voltage or high-temperature applications?
The 96% Al2O3 composition provides a low dielectric constant and low dielectric loss while maintaining high mechanical strength (>350 MPa flexural strength) and a breakdown voltage ≥15 kV/mm. This combination makes it suitable for insulating substrates in power electronics where both electrical insulation and mechanical robustness are required.
What is the surface roughness of this substrate, and how does it affect adhesion for thin-film deposition or thick-film printing?
The surface roughness is Ra 0.15–0.30 µm, a typical as-fired finish for 96% alumina. This roughness may require additional polishing for thin-film applications demanding ultra-smooth surfaces, but it is generally acceptable for thick-film printing. Custom polishing or coating options are available upon request.
What are the thermal conductivity and density specifications that influence heat dissipation and weight in system design?
The thermal conductivity is >24 W/(m·K) and density is ≥3.70 g/cm³. These values indicate moderate heat spreading capability and a relatively dense ceramic, which should be considered when designing thermal management systems and mounting structures for the substrate.
This 96% alumina ceramic substrate (125 mm x 125 mm x 3 mm, pack of 10) offers high flexural strength (>350 MPa) and thermal conductivity (>24 W/m·K) suitable for high-temperature or electrically insulating platforms, though Ra 0.15–0.30 µm surface roughness and 3 mm thickness impose constraints on thin-film deposition and precision bonding applications.
Positive
- High mechanical and thermal performance: Flexural strength >350 MPa and thermal conductivity >24 W/(m·K) enable use in mechanically demanding, heat-dissipating lab setups such as high-temperature fixtures or power electronic substrates.
- Consistent dielectric properties: Low dielectric constant and loss combined with a breakdown voltage ≥15 kV/mm ensure reliable electrical insulation for high-voltage or RF isolation applications.
Trade-offs
- Moderate surface roughness limits precision use: With Ra 0.15–0.30 µm, the as-fired surface may require polishing or additional finishing before thin-film metallization, photolithography, or hermetic sealing steps.
- Fixed 3 mm thickness constrains integration: The 3 mm thickness adds rigidity and thermal mass, which may complicate integration into compact or lightweight assemblies and reduce thermal cycling tolerance in rapid ramp applications.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
