96% Alumina Ceramic Substrate, 40 mm x 40 mm x 0.5 mm, Pack of 50Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What is the dielectric strength of the 96% alumina ceramic substrate and how does it support high-voltage isolation?
The breakdown voltage is ≥15 kV/mm, providing reliable electrical insulation. Combined with low dielectric constant and loss, it is suitable for high-voltage applications such as insulating substrates for power electronics.
What is the surface roughness of this substrate and what options exist for improving surface finish for thin-film applications?
The as-fired surface roughness is Ra 0.15–0.30 μm. For applications requiring smoother surfaces, polishing options are available; contact technical sales to confirm custom surface finish requirements.
What mechanical properties of this 96% alumina substrate should be considered for machining or dicing?
With Vickers hardness of 14 GPa and flexural strength >350 MPa, the substrate is hard and brittle. Diamond tooling is recommended for cutting or drilling, and care must be taken to avoid edge chipping. The material's high density (≥3.70 g/cm³) also contributes to its mechanical stability.
This 96% alumina ceramic substrate (40x40x0.5 mm, pack of 50) provides a high-mechanical-strength, electrically insulating platform with >350 MPa flexural strength and >24 W/(m·K) thermal conductivity, suited for thin-substrate circuit or packaging applications, though the 0.5 mm thickness requires careful handling during machining or assembly to avoid fracture.
Positive
- High mechanical and thermal performance: Flexural strength >350 MPa and thermal conductivity >24 W/(m·K) enable robust mechanical support and effective heat dissipation in power electronics or RF applications.
- Electrical insulation with low dielectric loss: Breakdown voltage ≥15 kV/mm and low dielectric constant/loss provide reliable electrical isolation and minimal signal degradation in high-frequency circuits.
Trade-offs
- Thin substrate handling fragility: At 0.5 mm thickness, the substrate is more susceptible to breakage during manual handling, dicing, or automated pick-and-place operations without proper support.
- Surface roughness may affect bonding: Ra 0.15–0.30 μm surface finish may require additional polishing or surface treatment for applications demanding low-defect interfaces, such as thin-film metallization or direct bonding.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
