96% Alumina Ceramic Substrate, 200 mm x 200 mm x 1 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What is the dielectric breakdown rating of the 1 mm thick 96% alumina substrate?
The substrate is specified with a breakdown voltage of at least 15 kV/mm, so the supplied 1 mm thick plate has a nominal through-thickness breakdown threshold of ≥15 kV under uniform field conditions. The 96% Al2O3 body is also described as providing high electrical insulation, low dielectric constant, and low dielectric loss.
Is the standard Ra 0.15-0.30 µm surface finish suitable for polished or metallized ceramic applications?
The standard substrate is supplied with surface roughness Ra 0.15-0.30 µm, and it is not listed as pre-polished or pre-metallized. Suitability depends on your process; polishing, coating, metallization, and custom-shape requirements must be confirmed with Atomfair as option-matching items before quotation.
What mechanical strength and thermal conductivity values are specified for this substrate, and how do they affect handling?
This 96% alumina ceramic is specified with flexural strength >350 MPa, Vickers hardness 14 GPa, density ≥3.70 g/cm³, and thermal conductivity >24 W/(m·K). Because the product is a 200 mm x 200 mm x 1 mm ceramic plate, it should be supported flat and protected from point loads and edge impacts during handling despite its relatively high flexural strength.
This 96% alumina ceramic substrate (200 mm x 200 mm x 1 mm, pack of 10) delivers a balance of high mechanical strength (>350 MPa flexural), electrical insulation (breakdown voltage ≥15 kV/mm), and thermal conductivity (>24 W/(m·K)), making it suitable for demanding laboratory and thin-film substrate applications, though its as-fired surface roughness (Ra 0.15–0.30 μm) and thickness must be confirmed for precision coating or metallization processes.
Positive
- High mechanical and dielectric strength: Flexural strength >350 MPa and breakdown voltage ≥15 kV/mm provide robust mechanical support and reliable electrical isolation for high-voltage or load-bearing test fixtures.
- Useful thermal conductivity for heat dissipation: Thermal conductivity >24 W/(m·K) facilitates moderate heat spreading in power device or thick-film circuit prototypes where organic substrates would fail.
Trade-offs
- Surface roughness may limit thin-film adhesion: As-fired surface roughness of Ra 0.15–0.30 μm may require polishing or surface treatment for applications demanding ultra-smooth interfaces, such as thin-film metallization or optical coatings.
- Fixed dimensions require pre-order verification: Sizing is confined to 200 mm x 200 mm x 1 mm per piece; any custom shaping, tolerance adjustment, or thickness variation must be confirmed before procurement to avoid integration mismatches.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
