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Sapphire Off-Cut Substrate 2 inch C/M 0.5° SSP ATOMFAIR®

Sapphire Off-Cut Substrate 2 inch C/M 0.5° SSP ATOMFAIR®

$32.90

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

2 inch C/M off-cut sapphire substrate, >99.99% monocrystalline Al2O3, 0.5° angle, 430±25 μm SSP wafer with Ra <0.3 nm. TTV <10 μm, BOW/WARP <15 μm. Order now.

SKU: AF-WF-S-SOFF-02IN-S031
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Off-Cut Sapphire Substrate – 2 inch (50.8 mm) C/M off-cut 0.5 degree Single-Side Polished
Product Type: Off-cut sapphire substrate
Research-grade laboratory product
Product Overview

2 inch (50.8 mm) off-cut sapphire substrate is supplied as high-purity monocrystalline Al2O3 (KY) with C/M off-cut orientation and 0.5 degree off-cut selection.

The diameter-specific specification includes 430 +/- 25 um thickness, 16 mm primary flat, <10 um TTV, <15 um BOW and <15 um WARP.
Performance Features
  • Off-cut orientation and angle are shown as clear selectable specifications.
  • Single-Side Polished surface finish includes separate front-side and back-side roughness specifications.
  • Diameter-specific thickness, flat, TTV, BOW and WARP values are presented for specification review.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-SOC-CM2A05
Material >99.99% high-purity monocrystalline Al2O3 (KY)
Off-Cut Orientation C/M off-cut
Off-Cut Angle 0.5 degree
Diameter 2 inch (50.8 mm)
Thickness 430 +/- 25 um
Primary Flat 16 mm
Polishing Single-Side Polished
Front-Side Roughness Epi-ready, Ra <0.3 nm
Back-Side Roughness Fine ground, Ra <1.2 um
TTV <10 um
BOW <15 um
WARP <15 um
Package 1 piece/set
Off-Cut Details: Select C/M off-cut, 0.5 degree, 2 inch (50.8 mm) and Single-Side Polished.
Packaging Details: Package 1 piece/set; Package size follows the selected configuration.
Thickness Options: Standard 430 +/- 25 um thickness or any preferred custom thickness.
Ordering Details: Share the selected model, configuration, quantity and any thickness or packaging preference.
PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

What is the off-cut angle and orientation of the Atomfair AF-SOC-CM2A05 2-inch sapphire substrate?

The substrate has a C/M off-cut orientation with a 0.5 degree off-cut angle. This is a selectable specification detailed in the product model AF-SOC-CM2A05, and the off-cut angle is critical for controlling step-terrace structure in epitaxial growth applications.

What are the surface roughness specifications for the front and back sides of this single-side polished sapphire substrate?

The front side is epi-ready with a roughness Ra < 0.3 nm, suitable for direct epitaxial deposition. The back side is fine ground with a roughness Ra < 1.2 μm, providing a matte finish for handling and optical scattering reduction.

What are the thickness, TTV, BOW, and WARP tolerances for the 2-inch off-cut sapphire substrate?

The thickness is 430 ± 25 μm with a total thickness variation (TTV) < 10 μm, bow < 15 μm, and warp < 15 μm. These tight tolerances ensure compatibility with standard wafer processing equipment and photolithography alignment.

This 2-inch off-cut sapphire substrate provides high-purity monocrystalline Al2O3 (KY) with C/M off-cut at 0.5°, epi-ready front-side roughness (<0.3 nm Ra), and tight geometric tolerances (TTV <10 μm, BOW <15 μm, WARP <15 μm), making it suitable for III-nitride epitaxial growth; however, the single-side polish and specific off-cut angle may require process adaptation for certain applications.

Positive

  • High-purity monocrystalline Al2O3: Material purity >99.99% minimizes defect nucleation and contamination during epitaxial growth or device fabrication.
  • Epi-ready front-side polish: Front-side roughness Ra <0.3 nm provides a pristine surface for high-quality thin-film deposition without additional planarization.

Trade-offs

  • Single-side polish only: Back-side is fine ground with Ra <1.2 μm, which may require additional polishing or handling precautions for double-side processing or optical transparency applications.
  • Specific off-cut angle constraint: The 0.5° C/M off-cut is fixed; alternative off-cut angles or on-axis substrates are not available in this configuration, limiting compatibility with standard epitaxial recipes that require exact orientations.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

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