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Sapphire Substrate – 2 inch (50.8 mm) C-Plane Double-Side Polished
Product Type: Sapphire substrate
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What is the front- and back-side surface roughness specification for the double-side polished 2-inch C-plane sapphire substrate?
Both sides have an epi-ready roughness of Ra <0.3 nm, as specified in the technical specifications for the 2-inch C-plane double-side polished sapphire substrate.
What thickness options are available for the 2-inch C-plane sapphire substrate beyond the standard 430 μm?
In addition to the standard 430 ± 25 μm thickness, optional thicknesses of 200 μm, 400 μm, and 1000 μm are available for this 2-inch C-plane double-side polished sapphire substrate.
What is the crystallographic orientation and primary flat configuration of the 2-inch sapphire substrate?
The substrate is C-plane oriented with an A-plane 16 mm primary flat, as stated in the product specifications for the 2-inch double-side polished sapphire wafer.
Atomfair 2-inch C-plane double-side polished sapphire substrate offers high-purity monocrystalline Al2O3 with epi-ready surface roughness (<0.3 nm) on both sides, suitable for epitaxial growth and device fabrication. Tight geometric tolerances and thin substrate require careful handling in cleanroom conditions.
Positive
- High-purity monocrystalline Al2O3: >99.99% purity C-plane sapphire provides a chemically stable, lattice-matched substrate for epitaxial deposition of III-nitride materials.
- Epi-ready double-side polish: Both sides achieve Ra <0.3 nm, enabling direct use for thin-film growth or device processing without additional surface preparation.
Trade-offs
- Thin substrate fragility: Standard thickness of 430 ± 25 μm requires careful handling during transfer and mounting to avoid breakage, especially when using thinner options.
- Tight geometric tolerances: TTV, BOW, and WARP all <10 μm demand cleanroom-grade handling and temperature-stable storage to maintain wafer flatness specifications.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
