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Off-Cut Sapphire Substrate – 2 inch (50.8 mm) R/M off-cut 2 degree Single-Side Polished
Product Type: Off-cut sapphire substrate
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the surface roughness specifications for the front and back sides of this off-cut sapphire substrate?
The front side is epi-ready with a roughness of Ra <0.3 nm, while the back side is fine ground with a roughness of Ra <1.2 μm. These specifications are critical for epitaxial layer quality and substrate handling during device fabrication.
What are the TTV, BOW, and WARP specifications for this 2-inch off-cut sapphire substrate?
The substrate has a Total Thickness Variation (TTV) of <10 μm, Bow of <15 μm, and Warp of <15 μm. These tight tolerances ensure uniform thickness and flatness, which are essential for consistent epitaxial growth, lithography alignment, and wafer bonding processes.
Can I order this substrate with a custom thickness?
Yes, while the standard thickness is 430 ± 25 μm, custom thickness options are available upon request. Contact technical sales to specify your preferred thickness and other requirements.
This 2-inch off-cut sapphire substrate (R/M off-cut, 2° angle) provides an epi-ready front surface (Ra <0.3 nm) and tight geometric tolerances (<10 μm TTV, <15 μm BOW, <15 μm WARP), suitable for high-quality epitaxial growth in research and device fabrication.
Positive
- Epi-ready front-side roughness: Front-side surface roughness Ra <0.3 nm enables direct use for epitaxial thin-film deposition without additional polishing, reducing preparation steps.
- Precise R/M off-cut angle: The 2-degree off-cut orientation provides controlled step-terrace morphology for optimized epitaxial growth of III-nitride and other thin-film materials.
Trade-offs
- Back-side fine ground finish: Back-side roughness Ra <1.2 μm is not polished, requiring careful handling to avoid scratching during mounting or thermal cycling in processing equipment.
- Tight mechanical tolerances: TTV <10 μm, BOW <15 μm, and WARP <15 μm impose strict constraints on substrate clamping and thermal management, potentially limiting compatibility with some older or less precise tooling.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
