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Off-Cut Sapphire Substrate – 2 inch (50.8 mm) C/A off-cut 0.2 degree Single-Side Polished
Product Type: Off-cut sapphire substrate
Research-grade laboratory product
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E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What is the significance of the 0.2 degree off-cut angle for GaN epitaxy on sapphire?
The 0.2 degree off-cut on C/A oriented sapphire creates a vicinal surface that suppresses spiral growth and reduces threading dislocations in GaN films. This is specified in the product's off-cut orientation and angle, with front-side epi-ready roughness Ra<0.3 nm.
Can this substrate be used for high-temperature processes like MOCVD without warping?
The substrate has a BOW of <15 um and WARP of <15 um, ensuring minimal deformation at typical MOCVD temperatures. The 430 um thickness provides rigidity, and the material is high-purity monocrystalline Al2O3 (KY) with >99.99% purity.
What are the mechanical constraints imposed by the 430 um thickness during automated wafer handling?
The 430 um thickness is standard for 2-inch sapphire substrates, providing sufficient rigidity for automated handling while being thin enough for thermal conduction. The TTV is <10 um, ensuring uniform clamping in vacuum chucks.
This 2-inch single-side polished off-cut sapphire substrate (C/A, 0.2°) provides epi-ready front surface roughness (Ra<0.3 nm) and tight geometric tolerances (TTV<10 um, BOW<15 um, WARP<15 um) for high-precision thin-film growth, but the fine-ground back-side finish and fixed off-cut angle impose specific substrate preparation and application constraints.
Positive
- Epi-ready front-side finish: Front-side roughness Ra<0.3 nm enables direct epitaxial layer deposition without additional polishing, critical for high-quality thin-film growth in semiconductor and photonics applications.
- Tight geometric tolerances: TTV<10 um, BOW<15 um, and WARP<15 um ensure uniform substrate flatness across the wafer, minimizing process variability during lithography, bonding, and thin-film processing.
Trade-offs
- Single-side polished only: The back-side is fine ground with Ra<1.2 um, not polished. This may require additional back-side processing for double-side applications or optical transmission measurements.
- Fixed off-cut angle: The 0.2 degree off-cut is predetermined; applications requiring a different miscut angle or exact step-terrace control may necessitate custom ordering, potentially increasing lead time.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
