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Copper (Cu) Evaporation Material, Wire, 99.999%, Dia. 2.0 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This evaporation material requires compatibility verification with the deposition source hardware and process route. Proper matching of material behavior, melting point, and film requirements is essential before use.
- Deposition Source Compatibility: Confirm compatibility with W/Mo/Ta filament, basket, coil, or boat evaporation sources.
- Process Route Matching: Match the evaporation method and source hardware to the material's melting point and film requirements.
- Documentation Review: Review certificate, safety data sheet, and shipment conditions for laboratory use requirements.
- Procurement Confirmation: Confirm model, purity, form, size range, pack size, and deposition-source compatibility before quotation.
What evaporation source configurations are compatible with the 2.0 mm diameter copper wire?
This copper wire is designed for thermal/resistive evaporation using W/Mo/Ta filament, basket, coil, or boat sources. The 2.0 mm diameter wire form facilitates loading into these common evaporation source geometries.
What are the key physical properties of this copper evaporation material that influence deposition process control?
Copper has a melting point of 1,083°C, density of 8.92 g/cm³, and a Z-ratio of 0.437. These properties affect the required power, deposition rate, and film thickness monitoring. The Z-ratio is a parameter used for accurate thickness calibration during thermal evaporation.
How do the available pack sizes and price tiers for this copper wire support different research scales?
The product is offered in 25g, 100g, 500g, and 1kg packages with indicative prices of USD 210, 440, 1150, and 1500 respectively. This allows researchers to select a quantity appropriate for their deposition run length and budget, with larger packs providing a lower per-gram cost.
Copper (Cu) evaporation wire with 99.999% purity and 2.0 mm diameter offers high-purity feedstock for thermal evaporation, but requires high-temperature source hardware and mandatory pre-purchase compatibility verification.
Positive
- High 99.999% Purity: The 5N purity grade minimizes contamination in thin-film deposition, critical for electronic and optical applications where trace impurities affect film properties.
- Specified Wire Form and Diameter: Wire form with 2.0 mm diameter is pre-sized for use in common thermal evaporation sources (W/Mo/Ta filament, basket, coil, boat), reducing preparation time.
Trade-offs
- High Melting Point Requires Robust Source Hardware: The 1,083°C melting point necessitates the use of high-temperature evaporation sources such as W, Mo, or Ta filaments, baskets, coils, or boats, as specified, excluding lower-temperature hardware.
- Documentation and Compatibility Checks Required: The product listing explicitly requires buyers to confirm model, purity, form, size, pack size, and deposition-source compatibility, and to review certificates and safety data sheets before quotation, adding pre-purchase administrative steps.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
