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Copper Oxide (Cu2O) Evaporation Material, Powder, 99.95%, < 77 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Copper Oxide (Cu2O) evaporation material is a nanopowder with specific processing constraints for vacuum thin-film deposition. Proper source matching and handling procedures are required to achieve consistent film quality and avoid equipment contamination.
- Deposition Method: E-beam evaporation is the preferred method; thermal evaporation requires RFQ confirmation.
- Source Liner: Use graphite, Al2O3, or BN liners for E-beam evaporation, or W, Mo, or Ta boats for thermal evaporation.
- Particle Size: The powder particle size is less than 77 nm, which affects source loading and evaporation behavior.
- Melting Point: The melting point of 1235°C must be considered for power settings and deposition rate control.
- Pre-Order Compatibility: Confirm the material's deposition-source compatibility, purity, and particle size before quotation.
What evaporation method is recommended for Cu2O powder with <77 nm particle size?
E-beam evaporation is preferred due to the material's powder form and fine particle size; thermal evaporation is available by RFQ. The material performs well with E-beam using a graphite, Al2O3, or BN liner, or a W/Mo/Ta boat, with a Z-Ratio of 1.00 and melting point of 1235°C.
What crucible or liner materials are compatible with Cu2O evaporation?
Cu2O evaporation material is compatible with E-beam hearths using graphite, Al2O3, or BN liners, or W/Mo/Ta boats. For sheet2 hardware, tantalum, graphite, and Al2O3 are specified. The listed hardware ensures good E-beam performance.
What safety documentation should be reviewed before handling Cu2O nanopowder?
Buyers should review the certificate of analysis and safety data sheet (SDS) for the material. The product is a nanopowder (<77 nm), and the supplier recommends confirming shipment conditions and export requirements for laboratory use.
This Copper Oxide (Cu2O) evaporation material offers 99.95% purity and sub-77 nm particle size for consistent thin-film deposition, but requires E-beam evaporation with compatible liners or boats; thermal evaporation is available only by RFQ.
Positive
- High purity and controlled particle size: 99.95% purity and sub-77 nm particle size enable consistent film quality and reproducible deposition rates for research-grade thin-film applications.
- Defined material identity and formula: Explicit Cu2O specification and compound evaporation material type allow precise process matching and procurement clarity for laboratory workflows.
Trade-offs
- Thermal evaporation requires RFQ: E-beam evaporation is the preferred method; thermal evaporation is only available by request for quotation, which may involve additional lead time and custom process validation.
- Deposition source compatibility must be verified: The powder form and specific liner/boat requirements (graphite, Al2O3, BN, W/Mo/Ta) necessitate careful matching with existing evaporation hardware to avoid contamination or poor film quality.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
