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Copper Oxide (Cu2O) Evaporation Material, Powder, 99.95%, 16 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This material requires specific evaporation source hardware and liner materials to avoid contamination. The fine powder form and melting point of 1,235 °C demand careful matching of deposition parameters to ensure consistent film quality.
- Evaporation Source Compatibility: Use an e-beam hearth with graphite, Al2O3, or BN liner, or a W/Mo/Ta boat, to prevent chemical reaction with the source.
- Powder Handling: Handle the 16 nm powder in a controlled environment to minimize airborne dispersion and ensure uniform loading into the source.
- Melting Point Consideration: Match the 1,235 °C melting point to the deposition source's power capacity and temperature monitoring system.
- Evaporation Method Preference: E-beam evaporation is recommended; thermal evaporation requires a quotation and may yield different deposition rates.
How does the 99.95% purity of this Cu2O evaporation material affect thin-film quality?
The 99.95% purity specification minimizes metal and oxide impurity levels, reducing defect density and improving film stoichiometry in optical or electronic applications. This grade allows direct comparison with standard or higher-purity materials by referencing the listed purity value in the technical specifications.
What evaporation hardware is compatible with Cu2O powder for reliable deposition?
Cu2O evaporation material is preferred for e-beam evaporation using a hearth lined with graphite, Al2O3, or BN, or using a W/Mo/Ta boat. Thermal evaporation is available by RFQ. The source explicitly lists these hardware options and states that e-beam performance is good with the recommended liners and boats.
What is the melting point of Cu2O and how does it influence deposition process parameters?
Cu2O has a melting point of 1,235 °C as stated in the technical specifications. This temperature dictates the choice of crucible or boat material to withstand thermal stress and avoid contamination, and determines the power settings required for stable evaporation in e-beam or thermal processes.
Copper Oxide (Cu2O) evaporation material (99.95% purity, 16 nm powder) is evaluated for vacuum thin-film deposition. It offers good e-beam performance with graphite/Al2O3/BN liners or W/Mo/Ta boats, but thermal evaporation requires RFQ and hardware compatibility must be verified.
Positive
- High purity and fine particle size: 99.95% purity and 16 nm particle size enable controlled, reproducible thin-film deposition with consistent material flux.
- Good e-beam performance with multiple liner options: Compatible with graphite, Al2O3, BN liners and W/Mo/Ta boats, providing flexibility for various e-beam evaporation source configurations.
Trade-offs
- Limited evaporation method flexibility: Thermal evaporation is not standard and requires RFQ, adding procurement lead time and process verification effort.
- Hardware matching required for optimal performance: Evaporation source geometry and liner material must be matched to the material's melting point (1235°C) and density (6 g/cm³) to achieve stable deposition rates.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).






