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Boron Nitride (BN) Evaporation Material, Powder, 99.5%, <250 nm Purity: 99.5%
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This material is intended for vacuum thin-film deposition via E-beam evaporation, but exhibits poor performance under standard E-beam conditions. Deposition source hardware must be matched to the material's high melting point and powder form, with thermal evaporation requiring RFQ confirmation.
- Deposition Source Compatibility: The material requires an E-beam hearth with a compatible liner; use of a high-temperature crucible for thermal evaporation must be confirmed via RFQ.
- Evaporation Method Performance: E-beam evaporation is the preferred method but the material exhibits poor performance, necessitating process optimization or alternative approaches.
- Melting Point Requirement: The material's melting point of approximately 3000°C imposes high-temperature constraints on crucible and source materials.
- Particle Size Consideration: The powder particle size of less than 250 nm may affect source loading density and evaporation behavior, requiring careful handling.
What evaporation source configuration is compatible with Boron Nitride powder (<250 nm) for thin-film deposition?
The product is specified for use with an e-beam hearth equipped with a compatible liner; high-temperature crucible evaporation is available by RFQ. The fine powder form (<250 nm) requires careful loading to avoid particle loss or agglomeration, and buyers should confirm deposition source geometry before ordering.
Why is e-beam evaporation performance rated as poor for Boron Nitride powder, and what alternative methods are recommended?
The product description lists e-beam performance as 'Poor' for this Boron Nitride powder, likely due to its high melting point (~3000 °C) and low density (2.25 g/cm³), which can cause spitting or incomplete evaporation. While e-beam is preferred, thermal evaporation may be evaluated by RFQ as an alternative route.
Atomfair Boron Nitride (BN) evaporation powder (99.5%, <250 nm) offers high-purity fine-particle feed for vacuum thin-film deposition, but requires careful E-beam hardware matching due to poor E-beam performance and RFQ-dependent thermal feasibility.
Positive
- High-purity BN powder with sub-250 nm particle size: The 99.5% purity and <250 nm particle size enable controlled evaporation and uniform thin-film deposition in vacuum processes.
- Exceptional thermal stability for high-temperature evaporation: With a melting point of ~3000°C and density 2.25 g/cm³, this material is suited for high-temperature E-beam or thermal evaporation when using compatible crucible hardware.
Trade-offs
- Poor E-beam evaporation performance: The product is rated as 'Poor' for E-beam evaporation, requiring careful process optimization and compatible liner selection to avoid material degradation.
- Thermal evaporation requires RFQ for feasibility: Thermal evaporation is not a default option and must be evaluated via request for quotation, adding lead time and infrastructure dependency for high-temperature crucible sourcing.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
