96% Alumina Ceramic Substrate, 180 mm x 180 mm x 1 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What breakdown voltage does the 1 mm thick 96% alumina substrate provide?
The material is rated at a breakdown voltage of ≥15 kV/mm, so a 1 mm thickness provides at least 15 kV of isolation capability. It also has a low dielectric constant and low dielectric loss, which supports electrical insulation applications.
Can this 96% alumina substrate be supplied with polishing, coating, metallization, or custom shaping?
Polishing, coating, metallization, and custom-shape needs must be confirmed before ordering because they are not specified in the standard 180 mm x 180 mm x 1 mm, pack-of-10 configuration. Include the exact size, thickness, material grade, surface finish, package format, and quantity when contacting Atomfair technical sales.
What mechanical, surface, and chemical properties are specified for the 96% alumina substrate?
The substrate is specified with flexural strength >350 MPa, Vickers hardness 14 GPa, density ≥3.70 g/cm³, and surface roughness Ra 0.15-0.30 µm. The 96% Al2O3 material is further specified as having good corrosion resistance, chemical stability, and a high melting point.
This 96% alumina ceramic substrate (180 mm x 180 mm x 1 mm, pack of 10) delivers a balanced combination of electrical insulation (≥15 kV/mm breakdown voltage), moderate thermal conductivity (>24 W/m·K), and high flexural strength (>350 MPa) suitable for thin-substrate academic or prototyping use, though its as-fired surface roughness (Ra 0.15–0.30 μm) and moderate density (3.70 g/cm³) impose processing limits for demanding thin-film or metallization applications without post-finishing.
Positive
- High breakdown voltage and insulation: With a breakdown voltage ≥15 kV/mm at 1 mm thickness and low dielectric loss, this substrate provides reliable electrical isolation for high-voltage lab-scale circuits or test fixtures.
- Combined mechanical and thermal performance: Flexural strength >350 MPa and thermal conductivity >24 W/m·K support handling during processing and moderate heat dissipation in power-device testing, though not at the level of 99.6% alumina or beryllia alternatives.
Trade-offs
- Surface roughness requires post-finishing for thin films: As-fired surface roughness of Ra 0.15–0.30 μm may necessitate lapping or polishing for consistent thin-film adhesion or fine-line metallization, adding process steps and cost.
- Moderate density limits extreme thermal cycling: Density of 3.70 g/cm³ and 96% Al2O3 content yield lower thermal shock resistance compared to higher-purity or composite substrates; careful temperature ramping is advised in rapid-thermal-cycling setups.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
