Aluminium-Silicon 99/1wt% Pellets 1-3 mm ATOMFAIR®

This alloy evaporation material requires deposition-source compatibility verification before use. The pellets must be handled in a controlled environment to prevent oxidation and contamination.

• Deposition Source Compatibility: Confirm that the evaporation source hardware (Mo/W/Ta boat, graphite/alumina crucible, or e-beam hearth) is compatible with the material's melting point of 640 °C and density of 2.69 g/cm³.
• Purity and Form Verification: Verify that the specified composition (Al 99 wt%, Si 1 wt%) and pellet size (1-3 mm) match the deposition process requirements before loading.

This procedure outlines the steps for loading and evaporating Al/Si 99/1wt% pellets in a vacuum deposition system. Proper source selection and handling are critical to achieve uniform film deposition.

Required Equipment: Mo/W/Ta boat or graphite/alumina crucible or e-beam hearth, Vacuum deposition system

1. Select Deposition Source
   Choose a compatible evaporation source (Mo/W/Ta boat, graphite/alumina crucible, or e-beam hearth) based on the material's melting point and your system configuration.
2. Load Pellets into Source
   Transfer the required quantity of 1-3 mm pellets into the selected source, ensuring even distribution for consistent evaporation.
3. Set Evaporation Parameters
   Configure the thermal or e-beam evaporation system to achieve the material's melting point of 640 °C, monitoring the Z-ratio of 1.00 for rate control.
4. Initiate Vacuum Deposition
   Evacuate the chamber to the required base pressure and begin the evaporation process, adjusting power to maintain a stable deposition rate.

This Al/Si 99/1wt% evaporation material in pellet form (1-3 mm) is suited for thermal or e-beam deposition of aluminium-silicon alloy films. Its RFQ-based purity and source compatibility require pre-order technical confirmation, making it appropriate for custom or research workflows where precise composition and deposition parameters are specified.

Positive

• Defined binary alloy composition: Al 99 wt%, Si 1 wt% ensures precise stoichiometry for thin-film deposition of Al/Si layers, critical for semiconductor and metallization applications.
• Multiple evaporation source compatibility: Suitable for Mo/W/Ta boats, graphite/alumina crucibles, or e-beam hearths with TiB2-BN liners, offering flexibility in deposition hardware selection.

Trade-offs

• Purity on RFQ basis: Total purity is not specified as a fixed value; buyers must request quotation for purity verification, adding a pre-order qualification step and potential lead time.
• Deposition process must be confirmed: Evaporation method and source hardware require RFQ confirmation before ordering, preventing immediate off-the-shelf purchase and requiring engineering consultation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).