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Aluminium,1% Copper (Al/Cu 99/1wt%) Evaporation Material, Pieces, Composition: Al 99 wt%, Cu 1 wt%; total purity RFQ, 1-3 mm
Product Type: Alloy Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Supplier: Atomfair
Brand: ATOMFAIR®
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This document defines the operational constraints for aluminium-1% copper evaporation material in vacuum thin-film deposition workflows. The material requires source-compatible handling and explicit process verification before use.
- Deposition Source Compatibility: Select Mo/W/Ta boats, graphite/alumina crucibles, or e-beam hearths that match the intended evaporation method.
- Evaporation Route Selection: Use thermal/resistive or e-beam evaporation only after confirming source geometry and material behavior are compatible.
- Material Loading Constraint: Load pieces of a size range that fits the selected boat, crucible, or hearth geometry to support uniform evaporation.
- Procurement Verification: Confirm model, purity, form, size range, pack size, and deposition-source compatibility before requesting quotation.
- Documentation Review: Review certificate, safety data sheet, shipment conditions, and export requirements against the intended laboratory use.
This procedure covers the setup and operation of aluminium-1% copper evaporation pieces in vacuum thin-film deposition equipment. Users must verify source compatibility before loading and match process conditions to the material's thermal behavior.
Required Equipment: Vacuum deposition system, Mo/W/Ta evaporation boat, Graphite or alumina crucible, E-beam hearth
- Confirm source compatibility
Confirm the evaporation source geometry and material compatibility before loading the Al/Cu pieces. - Select evaporation hardware
Select the Mo/W/Ta boat, graphite/alumina crucible, or e-beam hearth appropriate for the intended thermal/resistive or e-beam process. - Load the evaporation material
Load the Al/Cu pieces into the selected evaporation source with attention to even distribution. - Match process parameters
Match the evaporation process parameters to the material behavior and required film properties. - Run the deposition cycle
Run the vacuum thin-film deposition cycle using thermal/resistive or e-beam evaporation.
What is the significance of the 'total purity RFQ' designation for the Al/Cu 99/1wt% evaporation material?
The 'total purity RFQ' indicates that the overall purity (including trace elements) is not fixed but can be quoted upon request, allowing researchers to specify custom purity requirements. The composition is fixed at Al 99 wt% and Cu 1 wt%, but the total purity level is negotiable based on application needs.
Which evaporation source hardware can be used with Al/Cu 99/1wt% evaporation pieces?
This material is compatible with thermal/resistive or e-beam evaporation using Mo/W/Ta boat, graphite/alumina crucible, or e-beam hearth. The specific hardware should be selected based on the material's melting point of 640°C and density of 2.82 g/cm³ to ensure proper deposition.
What physical form and size range is the Al/Cu 99/1wt% evaporation material supplied in?
The material is supplied as pieces with a pellet/piece size of 1–3 mm, available in pack sizes of 100g, 500g, or 1kg. This form factor facilitates loading into evaporation sources and ensures consistent feed during deposition.
This Al/Cu 99/1 wt% alloy evaporation material in 1-3 mm pieces is designed for thermal or e-beam deposition of Al-Cu thin films, with a melting point of 640°C and density of 2.82 g/cm³, requiring RFQ-based purity confirmation and source hardware matching.
Positive
- Defined alloy composition for film matching: The specified Al 99 wt%, Cu 1 wt% composition enables precise control over film stoichiometry in Al-Cu metallization layers, critical for semiconductor interconnect applications.
- Multiple pack sizes for scalability: Available in 100g, 500g, and 1kg packs, allowing researchers to match material quantity to experimental or pilot production needs without over-procurement.
Trade-offs
- Purity requires RFQ confirmation: Total purity is listed as RFQ, meaning the exact impurity profile is not pre-defined; buyers must request and verify certificate of analysis for process-critical applications.
- Source hardware compatibility must be verified: Evaporation source (Mo/W/Ta boat, graphite/alumina crucible, or e-beam hearth) must be matched to the material's melting point and form, requiring pre-order technical review to avoid deposition failures.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
