96% Alumina Ceramic Substrate, 60 mm x 60 mm x 1 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What electrical and thermal specifications does the AF-A96-S060P100 96% alumina ceramic substrate provide?
The 96% Al2O3 substrate is specified with a breakdown voltage of ≥15 kV/mm and thermal conductivity of >24 W/(m·K). It is described as a white dense ceramic with low dielectric constant and low dielectric loss, supporting use where electrical insulation and moderate thermal conduction are required.
Can the 60 mm x 60 mm x 1 mm substrate be supplied with polishing, coating, metallization, or a custom shape?
The product listing states that polishing, coating, metallization, and custom-shape needs must be confirmed when required for the application. The listed standard configuration is 96% alumina ceramic, 60 mm x 60 mm x 1 mm, pack of 10, so any modification should be verified with Atomfair technical sales before quotation.
What dimensional and surface-finish details should be verified before ordering this alumina substrate?
Size tolerance, thickness requirement, material grade, surface finish, and package format must be confirmed for this substrate before quotation. The catalog lists surface roughness as Ra 0.15–0.30 µm, but it does not state numeric dimensional tolerances, so exact requirements should be submitted to Atomfair when requesting pricing.
This 96% alumina ceramic substrate exhibits high flexural strength (>350 MPa) and Vickers hardness (14 GPa) suitable for mechanical support in high-temperature and corrosive environments, paired with low dielectric constant and loss for high-frequency applications. Its thermal conductivity (>24 W/(m·K)) and breakdown voltage (≥15 kV/mm) enable effective thermal management and electrical isolation in power electronics, though the as-fired surface roughness (Ra 0.15-0.30 μm) may require post-processing for thin-film metallization or precision coatings.
Positive
- High mechanical and thermal robustness: Flexural strength >350 MPa and thermal conductivity >24 W/(m·K) allow reliable operation under thermal cycling and mechanical load in power module substrates or thick-film circuits.
- Excellent dielectric and insulation performance: Low dielectric constant and loss combined with a breakdown voltage of ≥15 kV/mm make the substrate suitable for high-frequency RF circuits and high-voltage isolation barriers.
Trade-offs
- As-fired surface roughness limits thin-film use: With Ra 0.15-0.30 μm, the substrate may require polishing or lapping before thin-film deposition or precision coating processes, adding processing steps.
- Custom shaping and metallization require separate procurement: Additional polishing, coating, metallization, or custom-shape services must be requested separately, increasing lead time and coordination effort for application-specific substrates.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
