96% Alumina Ceramic Substrate, 115 mm x 115 mm x 0.12 mm, Pack of 10Product Type: Technical ceramic substrate
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
|
What is the thermal conductivity of this 96% alumina ceramic substrate and why is it important for thermal management in electronic substrates?
The thermal conductivity of this 96% alumina ceramic substrate exceeds 24 W/(m·K). This level of thermal conductivity, combined with low dielectric constant and loss, makes it suitable for dissipating heat from power devices and high-frequency circuits while maintaining electrical insulation, as specified in the product description.
Can this 96% alumina substrate be used for thin-film or thick-film circuit fabrication?
Yes, the substrate is compatible with thin-film and thick-film processes, but it may require optional steps such as polishing, coating, or metallization. The product description includes these as available options to be confirmed with the technical sales team (inquiry@atomfair.com) for application-specific requirements.
What handling precautions are necessary for the 0.12 mm thickness of this alumina substrate to prevent breakage?
Despite a flexural strength exceeding 350 MPa, the 0.12 mm thickness makes the substrate fragile. Handle with clean, non-abrasive tools, avoid bending or impact, and store in the original packaging to prevent mechanical failure. The product description also recommends confirming size tolerance and thickness requirements before use.
This 96% alumina ceramic substrate (115 mm x 115 mm x 0.12 mm, pack of 10) provides a high-purity, mechanically robust platform with flexural strength >350 MPa and thermal conductivity >24 W/(m·K), making it suitable for thin-film deposition or insulating circuit carrier applications requiring low dielectric loss.
Positive
- High mechanical and thermal performance: Flexural strength >350 MPa and Vickers hardness 14 GPa combined with thermal conductivity >24 W/(m·K) enable reliable thermal management and structural integrity in high-temperature or power-dissipation applications.
- Low dielectric constant and loss: Low dielectric constant and dielectric loss at 96% Al2O3 content reduce signal distortion and power loss in high-frequency or RF substrate applications.
Trade-offs
- Thin substrate handling fragility: At 0.12 mm thickness, the substrate is mechanically fragile and requires careful handling during processing to avoid fracture; automated pick-and-place or laser scribing may be needed for safe handling.
- Surface roughness tolerance constraints: As-fired surface roughness Ra 0.15–0.30 µm may require additional polishing or planarization for applications demanding ultra-smooth interfaces, such as thin-film metallization with tight adhesion requirements.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
