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Off-Cut Sapphire Substrate – 2 inch (50.8 mm) C/M off-cut 0.2 degree Single-Side Polished
Product Type: Off-cut sapphire substrate
Research-grade laboratory product
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PRODUCT SELECTION SUPPORT
For model selection, material matching or specification support, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the TTV, BOW, and WARP specifications for the 2-inch off-cut sapphire substrate, and how do they affect wafer processing uniformity?
The TTV (total thickness variation) is <10 µm, BOW (bow) is <15 µm, and WARP (warp) is <15 µm. These tight tolerances are critical for maintaining uniform focus in photolithography and ensuring consistent thin-film deposition across the 2-inch wafer.
What is the thickness tolerance for this 2-inch C/M off-cut sapphire substrate, and can custom thicknesses be ordered?
The standard thickness is 430 ± 25 µm. Custom thicknesses are available upon request, allowing adaptation to specific processing or mounting requirements.
What is the front-side surface roughness specification, and is this substrate classified as epi-ready for direct epitaxial growth?
The front-side surface roughness is Ra <0.3 nm and is designated as epi-ready, meaning it is suitable for immediate epitaxial deposition without additional polishing. The back-side is fine ground with Ra <1.2 µm.
This 2-inch C/M off-cut sapphire substrate with 0.2-degree off-cut angle provides high-purity monocrystalline Al2O3 with an epi-ready front surface, but the single-side polish and ±25 um thickness tolerance limit its use in double-sided or thickness-critical applications.
Positive
- High-purity monocrystalline Al2O3: The >99.99% purity minimizes contamination risk during epitaxial thin-film deposition, critical for semiconductor and photonics applications.
- Epi-ready front-side polish: Front-side roughness Ra <0.3 nm ensures an atomically smooth surface, enabling high-quality epitaxial growth of GaN, SiC, or other nitride films.
Trade-offs
- Single-side polish only: Back-side is fine ground with Ra <1.2 um, unsuitable for double-sided optical or thermal applications without additional lapping/polishing.
- Standard thickness tolerance ±25 um: The 430 um thickness with ±25 um tolerance may be too wide for applications requiring exact thickness matching, such as resonant cavities or precise optical path lengths.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
