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Tantalum Nitride (TaN) Evaporation Material, Pellets, 99.95%, 25 µm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This material requires E-beam evaporation with a compatible liner and high-temperature crucible. Deposition source geometry and process parameters must be matched to the material's melting point and density to avoid contamination or film failure.
- Evaporation Method Constraint: E-beam evaporation is the preferred method; thermal evaporation requires RFQ confirmation.
- Crucible Compatibility: Use an E-beam hearth with a compatible liner; high-temperature crucible may be required for thermal processes.
- Melting Point Handling: The melting point of 3360°C demands high-temperature handling and appropriate crucible materials.
- Density and Z-Ratio Consideration: Density of 16.3 g/cm³ and Z-ratio of 1.00 affect deposition rate and require calibrated process control.
- Procurement Verification: Confirm model, purity, form, size range, and deposition-source compatibility before ordering.
Follow these steps to prepare and use the TaN pellets for E-beam evaporation. Verify material specifications and hardware compatibility before deposition.
Required Equipment: E-beam evaporation system with compatible liner, High-temperature crucible (by RFQ)
- Verify Material Specifications
Confirm the model, purity, form, size range, and pack size match the deposition requirements. - Check Hardware Compatibility
Verify that the evaporation source hardware (E-beam hearth with liner) is compatible with the material. - Review Documentation
Review the certificate and safety data sheet for handling and storage conditions. - Match Process Route
Match the process route (E-beam or thermal) to the material's melting point and film requirements.
What is the significance of the Z-ratio of 1.00 for Tantalum Nitride (TaN) pellets in e-beam evaporation?
A Z-ratio of 1.00 indicates that the quartz crystal microbalance (QCM) film thickness monitor sees a direct proportionality between the deposited mass and the frequency shift, simplifying calibration. The product specification lists a Z-ratio of 1.00, which is explicitly stated in the technical parameters. This value is characteristic of the material and allows straightforward deposition rate monitoring without empirical correction factors.
What evaporation hardware is required for TaN pellets with a melting point of 3,360°C?
The product is designed for e-beam evaporation using an e-beam hearth with a compatible liner. For thermal evaporation, a feasibility request for quotation (RFQ) is required. The high melting point of 3,360°C and density of 16.3 g/cm³, both stated in the technical specifications, necessitate the use of a high-temperature crucible by RFQ to ensure proper material handling and deposition.
Can Tantalum Nitride (TaN) pellets with 25 µm particle size be used in thermal evaporation processes?
The product description specifies e-beam evaporation as the preferred method and states that thermal evaporation feasibility requires a request for quotation (RFQ). The 25 µm pellet size and the material's melting point of 3,360°C (provided in the specs) may limit compatibility with standard thermal sources; therefore, a technical review via RFQ is recommended to assess process suitability.
Tantalum Nitride (TaN) pellets at 99.95% purity and 25 µm size are evaluated for E-beam evaporation in thin-film deposition, with a high melting point of 3,360°C and density of 16.3 g/cm³ requiring compatible hearth liners and high-temperature crucibles, while thermal evaporation feasibility requires RFQ confirmation.
Positive
- High purity for consistent films: The 99.95% purity specification supports reproducible thin-film stoichiometry and reduces contamination risk in sensitive deposition processes.
- Defined pellet size for source loading: The 25 µm pellet form factor facilitates uniform source loading in E-beam hearths, aiding consistent evaporation rates and film thickness control.
Trade-offs
- E-beam preferred; thermal requires RFQ: Thermal evaporation feasibility is not guaranteed and must be confirmed via RFQ, adding a qualification step for labs without E-beam capability.
- High melting point demands specialized hardware: With a melting point of 3,360°C, the material requires compatible high-temperature crucibles and liners, increasing infrastructure and procurement complexity.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
