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Tantalum Nitride (TaN) Evaporation Material, Powder, 99.95%, 25 µm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This material requires e-beam evaporation hardware with a compatible liner for standard deposition. Thermal evaporation feasibility must be confirmed via RFQ and may necessitate a high-temperature crucible.
- Hardware Compatibility: Use only with an e-beam hearth and compatible liner for standard operation; thermal evaporation requires prior RFQ approval.
- High Melting Point Requirement: The melting point of 3360°C requires an e-beam source capable of heating the material to its evaporation temperature.
- Deposition-Source Compatibility Verification: Confirm deposition-source compatibility with the powder form and particle size before quotation and use.
Why is E-beam evaporation preferred over thermal evaporation for Tantalum Nitride (TaN) powder?
E-beam evaporation is preferred because TaN has a melting point of 3,360°C, requiring high-temperature capability. The product description specifies that E-beam evaporation with a compatible liner is the preferred method, while thermal feasibility requires a separate RFQ. This ensures proper material handling and film quality for thin-film deposition.
What crucible or liner configuration is required for TaN evaporation in E-beam systems?
The product description specifies use of an E-beam hearth with a compatible liner, and for high-temperature applications, a high-temperature crucible is available by RFQ. The specific liner material is not listed, so the procurement checklist advises confirming deposition-source compatibility before ordering.
What purity and documentation are available for TaN powder to support laboratory compliance?
The material is 99.95% pure Tantalum Nitride (TaN) in powder form (25 µm). The product description states that certificates, safety data sheets, shipment conditions, and export requirements can be reviewed against laboratory use requirements. Buyers should confirm certificate requirements before quotation.
Tantalum Nitride (TaN) evaporation material in powder form with 99.95% purity and 25 µm particle size is specified for e-beam evaporation using a compatible hearth liner, with a melting point of 3,360 °C and density of 16.3 g/cm³, requiring careful source geometry and process matching for thin-film deposition.
Positive
- High purity for consistent films: 99.95% purity specification enables reproducible thin-film stoichiometry and reduces contamination risk in sensitive deposition processes.
- Defined particle size for loading: 25 µm powder form facilitates uniform source loading and controlled evaporation rate in e-beam hearth systems.
Trade-offs
- E-beam evaporation preferred: Thermal evaporation requires RFQ feasibility confirmation; e-beam with compatible liner is the recommended method, limiting direct drop-in use for thermal systems.
- High melting point constraint: Melting point of 3,360 °C demands high-temperature crucible or specialized hearth liner, increasing infrastructure requirements for deposition hardware.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).






