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Copper Oxide (Cu2O) Evaporation Material, Powder, 99.95%, 38 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Deposition of this copper oxide material requires an E-beam hearth with graphite/Al2O3/BN liner or W/Mo/Ta boat, and E-beam evaporation is the preferred method. Process parameters including melting point, density, and Z-ratio must be matched to the deposition system for accurate film thickness control.
- Deposition Source Compatibility: Use E-beam hearth with graphite/Al2O3/BN liner or W/Mo/Ta boat for evaporation.
- Evaporation Method Preference: E-beam evaporation is the preferred method; thermal evaporation requires RFQ.
- Process Parameter Consideration: The melting point of 1,235°C and density of 6 g/cc must be considered for source loading and evaporation rate.
- Film Thickness Monitoring: The Z-ratio of 1.00 is used for quartz crystal monitor calibration during deposition.
- Hardware Matching: Evaporation source hardware must be matched to material behavior and film requirements.
Why is e-beam evaporation the preferred method for depositing Cu2O powder, and what are the limitations of thermal evaporation?
E-beam evaporation is preferred because it achieves good performance with this material, as stated in the source. Thermal evaporation is available only by special request (RFQ) because the material's melting point of 1,235 °C and powder form may require higher energy density and controlled heating to avoid decomposition. The source recommends using e-beam hearths with graphite, Al2O3, or BN liners, or W/Mo/Ta boats for optimal results.
What crucible or liner materials are compatible with evaporating Cu2O powder?
For e-beam evaporation, the recommended liner materials are graphite, aluminum oxide (Al2O3), or boron nitride (BN). For thermal evaporation, tungsten (W), molybdenum (Mo), or tantalum (Ta) boats are suitable. The source also lists tantalum and graphite as sheet hardware options. These materials are chosen to withstand the high melting point of 1,235 °C and to avoid contamination.
Why is the Z-Ratio of 1.00 significant for thin-film thickness monitoring when using this Cu2O material?
A Z-Ratio of 1.00 indicates that the acoustic impedance of the evaporant matches that of the quartz crystal sensor, allowing direct thickness monitoring without tooling factor adjustments. This simplifies process calibration for Cu2O deposition, as the source explicitly lists the Z-Ratio as 1.00. This is advantageous for achieving precise film thickness control in e-beam evaporation systems.
Copper Oxide (Cu2O) powder with 99.95% purity and 38 nm particle size is a research-grade evaporation material optimized for e-beam deposition. Its fine particle size enables controlled sublimation, while the high melting point necessitates compatible evaporation hardware and careful handling protocols.
Positive
- High Purity (99.95%) for Reliable Thin-Film Deposition: The 99.95% purity specification minimizes contamination sources during vacuum evaporation, supporting reproducible film stoichiometry and reduced defect density in oxide layers.
- Fine 38 nm Powder for Controlled Evaporation: The 38 nm particle size provides a high surface area and uniform sublimation behavior, enabling consistent deposition rates and improved film thickness uniformity in e-beam systems.
Trade-offs
- Powder Form Requires Special Handling: The fine powder (38 nm) presents inhalation and dust-control risks; handling must be performed in inert-atmosphere gloveboxes or fume hoods with appropriate PPE to avoid contamination and health hazards.
- High Melting Point Demands Robust Evaporation Hardware: With a melting point of 1,235°C, the material requires high-temperature e-beam hearths or liners (graphite, Al2O3, BN, W/Mo/Ta); thermal evaporation is only available via RFQ, indicating limited direct process compatibility.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
