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Copper Oxide (Cu2O) Evaporation Material, Powder, 99.5%, 38 nm
Product Type: Compound Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Copper oxide (Cu2O) evaporation powder requires E-beam evaporation as the preferred method, with thermal evaporation available only by RFQ. The material must be used with a graphite, Al2O3, or BN liner in an E-beam hearth, or a W/Mo/Ta boat, and buyers should confirm deposition source geometry before ordering.
- Evaporation Method: E-beam evaporation is the preferred method; thermal evaporation requires prior RFQ approval.
- Liner and Boat Compatibility: Use only graphite, Al2O3, or BN liners in an E-beam hearth, or W/Mo/Ta boats for thermal evaporation.
- Sheet Hardware: Sheet2 hardware must be tantalum or graphite.
- Process Monitoring Parameter: The material has a Z-ratio of 1.00, which directly influences film thickness monitoring during deposition.
- Procurement Confirmation: Buyers must confirm deposition source geometry, required pack size, certificate requirements, and shipment conditions before quotation.
Can Cu2O (Copper Oxide) powder be used for thermal evaporation, or is it limited to e-beam?
E-beam evaporation is preferred for Cu2O powder, with good performance reported. Thermal evaporation is possible but requires a request for quotation (RFQ) to confirm compatibility and process parameters.
What liner or boat materials are recommended for evaporating Cu2O powder?
For e-beam evaporation, use a graphite, Al2O3, or BN liner, or a W/Mo/Ta boat. For sheet2 hardware, tantalum or graphite is specified. These materials are listed to prevent contamination and ensure stable deposition.
What is the Z-ratio of Cu2O and how does it affect deposition monitoring?
The Z-ratio is 1.00, meaning the acoustic impedance matches the quartz crystal sensor exactly. This simplifies thickness monitoring by eliminating the need for a tooling factor correction.
Copper Oxide (Cu2O) evaporation material supplied as a 99.5% pure powder with 38 nm particle size, optimized for E-beam evaporation using graphite/Al2O3/BN liners or W/Mo/Ta boats, with good performance. The fine powder form requires careful handling to prevent dust and contamination, and compatibility verification is necessary before procurement.
Positive
- High purity and defined particle size: 99.5% purity and 38 nm particle size ensure consistent evaporation behavior and film quality, enabling precise control in thin-film deposition workflows.
- Flexible evaporation source compatibility: Compatible with E-beam evaporation (preferred) and thermal evaporation by RFQ, with good performance using E-beam hearths with graphite/Al2O3/BN liners or W/Mo/Ta boats, accommodating various deposition hardware setups.
Trade-offs
- Fine powder handling requirements: The 38 nm powder form requires careful handling to avoid dust generation, contamination, and potential agglomeration, demanding proper storage and laboratory protocols.
- Mandatory procurement compatibility check: Buyers must confirm model, purity, form, size, pack size, and deposition-source compatibility before ordering, adding a verification step to ensure proper fit with existing equipment and process parameters.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).






