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Tantalum (Ta) Evaporation Material, Wire, 99.95%, Dia. 2.0 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This material requires specific evaporation source hardware and process conditions for optimal thin-film deposition. Users must confirm deposition source geometry, pack size, and documentation requirements before use.
- Evaporation Source Compatibility: Use a water-cooled e-beam hearth or a tungsten/tantalum support by request for quotation.
- Evaporation Method Restriction: E-beam evaporation is preferred; thermal evaporation is only suitable for thin charges or qualified setups.
- Pre-Use Compatibility Verification: Confirm that the deposition source geometry and hardware match the wire diameter and form factor before loading.
- Process Control Parameter: Use the Z-ratio of 0.262 for accurate thickness monitoring during e-beam evaporation.
- Documentation Review: Review the certificate of analysis and safety data sheet to ensure compliance with laboratory safety requirements.
Follow these steps to verify compatibility and prepare the tantalum wire for deposition. Incorrect setup can lead to material waste or equipment damage.
Required Equipment: Water-cooled e-beam hearth, Tungsten or tantalum support (by RFQ)
- Confirm Deposition Source Geometry
Confirm that the deposition source geometry accommodates the 2.0 mm diameter wire and the required pack size. - Match Evaporation Method
Match the evaporation source hardware to the preferred method, selecting e-beam for standard use or thermal only for thin charge setups. - Verify Documentation Requirements
Verify that the certificate of analysis, safety data sheet, and shipment conditions meet the laboratory's procurement requirements.
Why is e-beam evaporation preferred over thermal evaporation for this tantalum wire?
E-beam evaporation is preferred because tantalum has a very high melting point of 2,996°C, and thermal evaporation is only suitable for thin charges or qualified setups. The product's Z-ratio of 0.262 indicates that e-beam provides more efficient energy transfer for controlled deposition rate and film thickness, whereas thermal evaporation may not achieve the necessary energy density without specialized equipment.
What are the specific requirements for the deposition source when using this tantalum wire?
The deposition source must be a water-cooled e-beam hearth or a tungsten/tantalum (W/Ta) support by RFQ. The wire diameter of 2.0 mm must match the source's feeding mechanism. Using an incompatible source can lead to uneven evaporation, contamination, or damage to the source hardware.
What safety and handling precautions are necessary for tantalum wire with a melting point of 2,996°C?
The high melting point of 2,996°C necessitates the use of water-cooled e-beam hearths to prevent thermal damage to equipment. The material's density of 16.6 g/cm³ requires careful handling to avoid injury from dropping or mishandling. Always consult the safety data sheet for specific handling, storage, and disposal precautions.
Tantalum (Ta) evaporation wire, 99.95% purity, 2.0 mm diameter, is specified for e-beam evaporation in water-cooled hearths; thermal evaporation is only acceptable for thin, qualified charges. The high melting point (2,996°C) and density (16.6 g/cm³) require careful deposition-source matching and infrastructure.
Positive
- High purity 99.95%: The 99.95% purity specification supports consistent thin-film composition and reduces contamination risk in vacuum deposition processes.
- Defined wire geometry: Wire form with 2.0 mm diameter facilitates predictable loading in e-beam hearths and enables repeatable evaporation rates.
Trade-offs
- E-beam evaporation preference: The material is recommended for e-beam evaporation; thermal evaporation is limited to thin, qualified charges only, restricting process flexibility.
- Infrastructure and source matching required: Deposition requires a water-cooled e-beam hearth or W/Ta support by RFQ; buyers must confirm source geometry and equipment compatibility before ordering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
