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Tungsten (W) Evaporation Material, Wire, 99.95%, Dia. 2.0 mm
Product Type: Pure Metal Evaporation Material
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For material selection, deposition-source matching, pack-size confirmation or quotation support, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Tungsten evaporation material requires careful source compatibility and process parameter matching due to its high melting point and specific Z-ratio. E-beam evaporation is the preferred method, with thermal evaporation only appropriate for thin charges under qualified setups.
- Evaporation Source Compatibility: Confirm that the deposition source is a water-cooled e-beam hearth or a tungsten/tantalum support rated for 2.0 mm diameter wire.
- Preferred Evaporation Method: Use e-beam evaporation for tungsten wire; thermal evaporation is only suitable for thin charges with a qualified setup.
- Process Parameter Calibration: Set deposition parameters using the material's melting point (3410°C) and Z-ratio (0.163) to control film thickness and uniformity.
- Infrastructure Requirement: Conduct all evaporation processes in a high-vacuum chamber to prevent oxidation and ensure film purity.
- Pre-Procedure Verification: Verify the model, purity, form, and pack size against the deposition hardware before loading the material.
This procedure outlines the steps to safely and effectively load and evaporate tungsten wire using e-beam or thermal evaporation. Proper source compatibility and parameter calibration are critical to achieve uniform films.
Required Equipment: Water-cooled e-beam hearth, Tungsten/tantalum support, E-beam evaporation system
- Verify Source Compatibility
Confirm that the evaporation source (water-cooled e-beam hearth or tungsten/tantalum support) is compatible with tungsten wire of 2.0 mm diameter. - Load Tungsten Wire
Load the tungsten wire into the source, ensuring proper contact and alignment for uniform evaporation. - Calibrate Deposition Parameters
Set the e-beam power and deposition rate using the material's melting point (3410°C) and Z-ratio (0.163) to achieve the desired film thickness.
What evaporation method is recommended for Tungsten (W) wire evaporation material with 99.95% purity and 2.0 mm diameter?
E-beam evaporation is preferred; thermal evaporation is only suitable for thin charges or qualified setups. This is due to tungsten's high melting point of 3,410°C and its Z-ratio of 0.163, which affect deposition control. The material should be used with a water-cooled e-beam hearth or W/Ta support by RFQ.
How does the Z-ratio of 0.163 for tungsten wire affect deposition process parameters?
The Z-ratio is a critical parameter for quartz crystal microbalance (QCM) monitoring. A Z-ratio of 0.163 indicates a specific acoustic impedance mismatch, which must be entered into the deposition controller to accurately measure film thickness. This value is product-specific for tungsten at 99.95% purity and wire form.
What are the key procurement considerations for Tungsten (W) evaporation wire in terms of pack size and source geometry?
The material is available in pack sizes of 100g, 500g, and 1kg. Buyers must confirm deposition source geometry, required quantity, and certificate requirements before quotation. The wire diameter of 2.0 mm must be compatible with the source loading mechanism. For water-cooled e-beam hearths, the wire shape is suitable, but for thermal setups, a qualified thin charge configuration is required.
Tungsten wire evaporation material (99.95% purity, 2.0 mm diameter) provides high melting point and density for e-beam deposition, but requires water-cooled e-beam hearth and is not suitable for thermal evaporation except under qualified thin-charge setups.
Positive
- High Purity and Defined Material Identity: 99.95% purity ensures consistent film composition and allows direct comparison with standard and high-purity grades for application-specific matching.
- Specified Wire Form and Diameter: Wire form with 2.0 mm diameter facilitates reproducible source loading and evaporation rate control in e-beam systems.
Trade-offs
- Evaporation Method Constraint: E-beam evaporation is preferred; thermal evaporation is only recommended for thin charges or qualified setups, limiting process flexibility.
- Infrastructure Dependency: Requires a water-cooled e-beam hearth or tungsten/tantalum support by RFQ, necessitating specific deposition system configuration.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
