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Small Sliding PECVD System, 1200 °C, 150 W RF
PLASMA-ENHANCED DEPOSITION EQUIPMENT
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LABORATORY PROCUREMENT SUPPORT
For model selection, configuration matching, power supply confirmation or quotation review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The system requires confirmation of tube size, heating-zone layout, gas-flow range, vacuum package, RF source, and power supply before quotation. Operation involves high temperature (1200 °C) and RF power (150 W), presenting electrical and thermal hazards.
- Pre-Installation Verification: Confirm the usable tube size, heating-zone layout, gas-flow range, vacuum package, RF power, and power supply before installation.
- Atmosphere Control: Maintain controlled-atmosphere conditions during deposition to prevent contamination and ensure process reproducibility.
- Thermal Safety: Operate within the 1200 °C temperature class, ensuring proper thermal insulation and avoiding exposure to hot zones.
- RF Safety: Handle the 150 W RF source with appropriate shielding and grounding to prevent electrical hazards.
This procedure outlines the safe initialization and operation of the PECVD system for thin-film deposition. Follow each step sequentially to ensure proper function and safety.
Required Equipment: Vacuum pump package, Gas supply system, RF source (150 W), Touch-screen control interface
- Verify System Configuration
Confirm the tube size, heating-zone layout, gas-flow range, vacuum package, RF source, and power supply match the required process specifications. - Initialize Vacuum
Start the vacuum pump and evacuate the chamber to the base pressure required for the deposition process. - Set Gas Flows
Set the gas flow rates for the process gases according to the deposition recipe, ensuring proper mixing and flow stability. - Heat the Furnace
Heat the furnace to the target deposition temperature, not exceeding the 1200 °C temperature class, and allow the temperature to stabilize. - Ignite RF Plasma
Enable the 150 W RF source and ignite the plasma, monitoring the reflected power to ensure stable plasma conditions. - Deposit Thin Film
Initiate the deposition process, monitoring the film growth rate and thickness in real time via the touch-screen interface. - Shut Down Safely
After deposition, turn off the RF source, stop gas flow, cool the furnace, and vent the chamber before removing the sample.
What configuration parameters must be specified before ordering the Atomfair PV-1200-1Z PECVD system?
Tube size, heating-zone arrangement, gas-flow channels, vacuum pump package, RF source, power supply, and required accessories must be confirmed before quotation to ensure compatibility with laboratory infrastructure and process requirements.
What integrated subsystems are included in this 1200 °C sliding PECVD system?
The system integrates a vacuum unit, gas supply system, 150 W RF source, automatic propulsion, and heating furnace configuration, all managed via a touch-screen control interface for intelligent operation.
What are the primary research applications for the Atomfair PV-1200-1Z sliding PECVD system?
It is designed for thin-film deposition, two-dimensional material growth, semiconductor-material preparation, and atmosphere-controlled laboratory process development.
The Small Sliding PECVD System (1200 °C, 150 W RF) integrates a sliding furnace, RF plasma source, and vacuum/gas modules into a compact R&D platform suitable for thin-film deposition, two-dimensional material growth, and semiconductor material preparation, but requires custom configuration of tube size, gas channels, and accessories per quotation.
Positive
- 1200 °C temperature class: Enables high-temperature chemical vapor deposition and annealing processes for refractory materials and advanced thin films.
- Integrated vacuum, gas, and RF modules: Combines vacuum unit, gas supply system, RF source, and automatic propulsion in a single platform, reducing lab footprint and simplifying system integration for R&D workflows.
Trade-offs
- 150 W RF power limitation: The 150 W RF source may constrain deposition rates or plasma density for processes requiring higher power, such as high-rate etching or thick-film deposition.
- Quotation-required configuration parameters: Tube size, heating-zone arrangement, gas-flow channels, vacuum pump package, and accessories must be confirmed before quotation, indicating non-standard configuration and potential lead time for customization.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
