Silicon Nitride Ceramic Substrate, 114 mm x 114 mm x 0.38 mmProduct Type: Technical ceramic substrate
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR?
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What are the flexural strength and fracture toughness of the Atomfair silicon nitride ceramic substrate model AF-SIN-S114P038?
The flexural strength exceeds 600 MPa and the fracture toughness is 6.5 MPa√m, as specified in the technical data. These values provide high mechanical stress resistance and stable shape retention for demanding ceramic substrate applications.
What is the usable temperature range and breakdown voltage of this 114 mm x 114 mm silicon nitride substrate?
The usable temperature range is -55 °C to 850 °C, and the breakdown voltage exceeds 15 kV/mm. These specifications make the substrate suitable for high-temperature and high-voltage insulation applications.
Can this silicon nitride ceramic substrate be customized with metallization or produced in custom shapes?
Yes, the product supports options including polishing, coating, metallization, and custom shapes such as tubes, rods, plates, and sheets. Configuration confirmation is required to verify specific needs like surface finish or metallization layers.
This 114 mm x 114 mm x 0.38 mm silicon nitride ceramic substrate offers a flexural strength above 600 MPa and thermal conductivity above 60 W/(m·K), making it suitable for demanding thermal management and high-stress insulation applications, though its brittle nature and plasma processing requirements impose operational constraints.
Positive
- High mechanical and thermal performance: Flexural strength >600 MPa and thermal conductivity >60 W/(m·K) enable stable shape retention and efficient heat dissipation in demanding substrate applications.
- Wide operating temperature range: Usable from -55 °C to 850 °C, providing reliable insulation and corrosion resistance across extreme thermal cycling environments.
Trade-offs
- Brittle failure under impact: As a ceramic, the substrate is susceptible to chipping or cracking from point loads or thermal shock, requiring careful handling and mounting.
- Requires precision processing for customization: Custom shapes, polishing, or metallization must be specified and confirmed, adding lead time and infrastructure demands for non-standard configurations.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
