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Laboratory Open-Cell Nickel Foam, 110 PPI, 100 × 200 × 3 mm, 1/5 pcs
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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How does the 110 PPI pore density affect the balance between surface area and mechanical strength for electrode applications?
The 110 PPI (0.23 mm nominal pore pitch) provides a high surface area with a through-pore rate ≥98% and porosity of 60–98%, but the tensile strength ranges from 8–50 MPa and compressive strength is ≥250 kPa. This open-cell structure allows good electrolyte flow and reactant access, though the relatively low bulk density (0.1–0.8 g/cm³) means mechanical support may be needed for high-pressure or load-bearing electrode assemblies.
Is this nickel foam suitable for use in acidic or alkaline electrolysis environments?
Yes, the nickel matrix is listed as resistant to acid/alkali conditions and can withstand temperatures ≥500°C with capability beyond 1100°C. The foam is explicitly recommended for hydrogen electrolysis, electrocatalysis, and electrochemical metallurgy. However, confirm specific pH, concentration, and temperature limits with the manufacturer for your exact electrolyte chemistry.
What is the recommended method for cutting or bonding this nickel foam without collapsing the pore structure?
The foam can be cut, bent, and bonded using standard fabrication techniques; the interconnected nickel skeleton maintains structural continuity when handled properly. Store in a clean, dry area and protect from heavy impact or crushing before use. For bonding, conductive adhesives or welding methods compatible with nickel are suitable, and the open-cell network remains intact if cutting tools are sharp and applied with minimal deformation.
This 110 PPI open-cell nickel foam sheet (100×200×3 mm) provides a high-permeability, low-mass metallic network with a nominal pore pitch of 0.23 mm, suitable for electrochemical electrodes, filtration, and heat-transfer applications. Its stated thermal tolerance up to >1100°C and corrosion resistance support deployment in aggressive high-temperature environments, though the delicate cellular structure demands careful handling and integration support.
Positive
- High through-pore open-cell network: The 110 PPI structure with 0.23 mm nominal pore pitch and a stated ≥98% through-pore rate enables efficient gas/liquid flow and extensive internal surface area for catalytic, filtration, and electrochemical reactions.
- High-temperature and corrosion resistance: Nickel matrix withstands temperatures above 500°C (up to >1100°C) and resists acid/alkali conditions, making it suitable for high-temperature electrochemical, catalytic, and metallurgical processes.
Trade-offs
- Requires careful handling to prevent damage: The open cellular structure is susceptible to crushing and contamination; storage in a clean, dry area and protection from heavy impact are essential to preserve pore integrity and material performance.
- Limited mechanical strength under load: With tensile strength in the 8–50 MPa range and compressive strength ≥250 kPa, the foam may deform under mechanical stress; it should be integrated into assemblies with adequate support or used in non-load-bearing roles.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).







