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Open-Cell Copper Foam 60 PPI 100 × 200 × 15 mm ATOMFAIR®
Open-Cell Copper Foam 60 PPI 100 × 200 × 15 mm ATOMFAIR® - Image 2

Open-Cell Copper Foam 60 PPI 100 × 200 × 15 mm ATOMFAIR®

Price range: $85.00 through $205.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, 60 PPI, 100 × 200 × 15 mm, porosity 50–80%, through-pore rate ≥98%, 1 or 5 pcs. Order now for lab evaluation.

SKU: AF-AF-F-C060-T015-BVAR
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Laboratory Open-Cell Copper Foam, 60 PPI, 100 × 200 × 15 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 60 PPI provides an interconnected porous-metal structure in a 100 × 200 × 15 mm sheet. Its nominal pore pitch is approximately 0.42 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C60-12T15
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 60 PPI
Nominal Pore Pitch 0.42 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 100 × 200 × 15 mm
Thickness 15 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 60 PPI open-cell structure with an approximately 0.42 mm nominal pore pitch.
  • 100 × 200 mm sheet dimensions with a 15 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 60 PPI open copper network in a 100 × 200 × 15 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.
SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Store the copper foam sheet in a clean, dry area to prevent contamination and oxidation of the high-surface-area copper network. Protect the open cellular structure from heavy impact, crushing, or deformation that could collapse the interconnected pore network.

  • Contamination Protection: The open-cell structure with ≥98% through-pore rate is susceptible to pore blockage from particulate contamination if stored in an unclean environment.
  • Mechanical Integrity: The low bulk density (0.1–0.8 g/cm³) and thin 15 mm thickness make the sheet prone to irreversible crushing under compressive loads or impact.

Inspect the delivered copper foam sheet for dimensional accuracy and visible pore structure integrity before any cutting, bonding, or installation step. Handle the sheet with care to avoid mechanical damage to the interconnected open-pore network.

Required Equipment: Clean, dry inspection surface, Calibrated ruler or caliper

  1. Inspect Package Condition
    Examine the shipping package for signs of crushing, moisture ingress, or contamination that could have damaged the foam sheet.
  2. Verify Sheet Dimensions
    Measure the sheet length, width, and thickness with a calibrated ruler or caliper to confirm they match the specified 100 × 200 × 15 mm dimensions.
  3. Assess Pore Structure Integrity
    Visually inspect the open-cell surface for any collapsed regions, compressed areas, or foreign debris that could compromise the interconnected pore network.
  4. Transfer to Clean Storage
    Place the inspected sheet in a clean, dry storage location away from heavy objects and potential contaminants until ready for cutting or integration.

What is the relationship between PPI rating and pore size for this 60 PPI copper foam?

For this 60 PPI foam, the nominal pore pitch is 0.42 mm, which corresponds to the average pore size. The material's general pore-size capability spans 0.1–10 mm across 5–120 PPI, so users can select different PPI variants to achieve specific pore dimensions for their application.

Is this 60 PPI open-cell copper foam suitable as a current collector for nickel-zinc battery electrodes?

Yes, the product is explicitly listed for use in nickel-zinc battery and electric-double-layer-capacitor electrode structures. Its 60 PPI open-cell structure with ≥98% through-pore rate and 50–80% porosity provides high internal surface area and a continuous copper network, making it suitable for current-collection and electrode framework applications.

What are the recommended storage and handling procedures for this copper foam sheet?

Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing, and contamination. After delivery, inspect the package condition, sheet dimensions, and visible pore structure before cutting, bonding, or installing the material.

This 60 PPI open-cell copper foam sheet (100×200×15 mm) provides a through-pore rate of at least 98% and a porosity range of 50–80%, yielding an interconnected network suited for electrode, catalyst-support, thermal-management, filtration, acoustic, and shielding applications. The copper framework supports electrical and thermal conduction, but the broad porosity and bulk-density ranges require application-specific verification of pore geometry and handling constraints.

Positive

  • Interconnected open-pore network: Through-pore rate ≥98% ensures a continuous open network, providing high internal surface exposure for electrode, catalyst-carrier, filtration, and acoustic-control evaluations.
  • Copper thermal and electrical conductivity: The copper framework supports thermal-transfer and electrical-conduction applications, making it viable for heat-dissipation components and current-collection structures.

Trade-offs

  • Handling and storage sensitivity: The open cellular surface must be protected from heavy impact, crushing, and contamination; storage in a clean, dry area is required to preserve structural integrity.
  • Broad porosity and density ranges: Porosity (50–80%) and bulk density (0.1–0.8 g/cm³) vary widely, so application-critical pore geometry and integration requirements must be confirmed before ordering.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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