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Open-Cell Copper Foam 20 PPI 200 × 200 × 15 mm ATOMFAIR®
Open-Cell Copper Foam 20 PPI 200 × 200 × 15 mm ATOMFAIR® - Image 2

Open-Cell Copper Foam 20 PPI 200 × 200 × 15 mm ATOMFAIR®

Price range: $115.00 through $335.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade open-cell copper foam sheet, AF-C20-20T15, 20 PPI, 200 × 200 × 15 mm, 50–80% porosity, ≥98% through-pore rate, 0.1–0.8 g/cm3.

SKU: AF-AF-F-C020-T015-cVAR
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Laboratory Open-Cell Copper Foam, 20 PPI, 200 × 200 × 15 mm, 1/5 pcs
Research-grade laboratory product
Product Overview

Open-cell copper foam with 20 PPI provides an interconnected porous-metal structure in a 200 × 200 × 15 mm sheet. Its nominal pore pitch is approximately 1.27 mm, offering a clearly defined cellular specification for laboratory selection and engineering integration.

The material is a foamed copper sheet with a stated porosity of 50–80%, a through-pore rate of at least 98% and a bulk-density range of 0.1–0.8 g/cm³. This combination preserves the continuous open network required for high internal surface exposure while retaining the thermal and electrical characteristics associated with the copper framework.

The open copper network can be evaluated for electrode frameworks and current-collection structures, catalyst-support assemblies, heat-transfer and heat-dissipation components, filtration and water-purification media, acoustic attenuation and electromagnetic-shielding structures, and fluid-pressure buffering devices. Selection should be based on PPI, sheet dimensions, thickness, package quantity and the intended integration method.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-C20-20T15
Material Foamed copper
Product Form Open-cell copper foam sheet
Cell Structure Interconnected open-pore network
Pore Density 20 PPI
Nominal Pore Pitch 1.27 mm
General Pore-Size Capability 0.1–10 mm (5–120 PPI)
Porosity 50–80%
Through-Pore Rate ≥98%
Bulk Density 0.1–0.8 g/cm³
Sheet Size 200 × 200 × 15 mm
Thickness 15 mm
Package Options 1 pcs; 5 pcs
Typical Applications Electrode frameworks, catalyst supports, thermal management, filtration, acoustic attenuation, electromagnetic shielding and fluid-pressure buffering
Key Features and Advantages
  • 20 PPI open-cell structure with an approximately 1.27 mm nominal pore pitch.
  • 200 × 200 mm sheet dimensions with a 15 mm nominal thickness.
  • Interconnected pores with a stated through-pore rate of at least 98%.
  • Stated porosity range of 50–80% and bulk-density range of 0.1–0.8 g/cm³.
  • Copper framework supports thermal-transfer and electrical-conduction applications.
  • High internal surface exposure supports electrode, catalyst-carrier, filtration and acoustic-control evaluations.
  • Available in 1-piece and 5-piece package quantities.
Application Scope

Suitable for laboratory and engineering evaluations that require a 20 PPI open copper network in a 200 × 200 × 15 mm format. Relevant uses include nickel-zinc battery and electric-double-layer-capacitor electrode structures, copper-containing wastewater recovery electrodes, catalyst and photocatalytic air-purification carriers, motor and electronic-component heat-transfer parts, filtration and water-purification media, acoustic attenuation, electromagnetic shielding and pressure-instrument buffering components.
SELECTION GUIDANCE: Confirm PPI, nominal pore pitch, porosity requirement, through-pore rate, sheet length and width, thickness, bulk-density range and required quantity before quotation. Confirm any application-critical pore geometry and integration requirements before ordering.
HANDLING & INSPECTION: Store the sheets in a clean, dry area and protect the open cellular surface from heavy impact, crushing and contamination. After delivery, check the package condition, sheet dimensions and visible pore structure before cutting, bonding or installing the material.
IMPORTANT NOTICE: Custom dimensions are available upon consultation. For a dimensional feasibility review, provide the target length, width, thickness, PPI and estimated quantity.
LABORATORY PROCUREMENT SUPPORT
For PPI selection, sheet-dimension confirmation, package support or application-specific configuration review, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Store the open-cell copper foam sheet in a clean, dry area to prevent contamination and oxidation. Protect the foam from heavy impact, crushing, and deformation to preserve the interconnected pore structure.

  • Storage Environment: Store in a clean, dry area to avoid moisture and particulate contamination.
  • Mechanical Protection: Avoid heavy impact, crushing, or deformation that could collapse the open-cell network.
  • Pre-Use Inspection: After delivery, check the package condition, sheet dimensions, and visible pore structure before cutting, bonding, or installing the material.

How does the 20 PPI pore density of this copper foam affect its suitability for electrode frameworks versus filtration applications?

The 20 PPI (pores per inch) corresponds to a nominal pore pitch of 1.27 mm, providing a balance between surface area and flow resistance. For electrode frameworks in batteries or capacitors, the high through-pore rate (≥98%) and porosity (50–80%) ensure good electrolyte access and ion transport. For filtration, the 20 PPI offers moderate particle retention; finer PPI would be needed for smaller particles. The bulk density range of 0.1–0.8 g/cm³ allows tuning of mechanical and electrical properties.

What are the key considerations for integrating this copper foam sheet into a nickel-zinc battery electrode structure?

The open-cell copper foam with 20 PPI and ≥98% through-pore rate provides a continuous conductive network for current collection and active material support. The 200×200×15 mm sheet size allows custom cutting to electrode dimensions. The copper framework offers high electrical conductivity, and the porosity range of 50–80% supports active material loading. The product is explicitly listed for nickel-zinc battery and electric-double-layer-capacitor electrode structures.

What storage and handling conditions are recommended to prevent oxidation or mechanical damage to the copper foam?

Store the sheets in a clean, dry area to minimize moisture exposure that could accelerate copper oxidation. Protect the open cellular surface from heavy impact, crushing, and contamination to preserve the interconnected pore structure. After delivery, inspect package condition, sheet dimensions, and visible pore structure before cutting or bonding. The bulk density range of 0.1–0.8 g/cm³ indicates a lightweight structure that can be easily deformed under pressure.

The Atomfair open-cell copper foam (20 PPI, 200×200×15 mm) provides a structurally defined, highly interconnected porous network with ≥98% through-pore rate and copper conductivity, suitable for laboratory-scale electrode, thermal, and filtration evaluations. Its mechanical sensitivity and porosity variability require careful handling and specification confirmation.

Positive

  • High through-pore rate and open network: ≥98% through-pore rate ensures uninterrupted fluid flow and high internal surface area, critical for electrode, catalyst-carrier, and filtration applications.
  • Copper framework for thermal and electrical conduction: The metallic copper skeleton provides intrinsic thermal and electrical conductivity, enabling use in heat-transfer components and current-collection structures.

Trade-offs

  • Mechanical fragility of open-cell foam: The open-cell structure is susceptible to crushing and deformation under impact; storage in a clean, dry area and protection from heavy loads are required to maintain pore integrity.
  • Wide porosity and density tolerance: The stated porosity range of 50-80% and bulk density of 0.1-0.8 g/cm³ introduce batch-to-batch variability that may affect reproducibility in applications with tight surface area or density requirements.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package Quantity

1 pcs, 5 pcs

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