Atomfair Hexagonal Boron Nitride (h-BN) Powder, Spherical Agglomerated Morphology, D50 50 μm
Product Description
Atomfair hexagonal boron nitride (h-BN) powder is supplied as spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets, with a D50 particle size of 50 μm and a tap density of 0.4–0.6 g/cm³. It is intended for thermal-interface-material research.
Technical Specifications
| PARAMETER DETAILS | |
|---|---|
| Product | Hexagonal Boron Nitride (h-BN) Powder |
| Chemical Formula | BN |
| Structure / Phase | Hexagonal boron nitride (h-BN) |
| Morphology | Spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets |
| D50 Particle Size | 50 μm |
| Tap Density | 0.4–0.6 g/cm3 |
| Water-Soluble Boron | 0.10% |
Customization & Ordering
Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.
Key Features and Advantages
- Morphology: Spherical, layered agglomerates formed from loosely compacted hexagonal boron nitride platelets.
- Specified D50 particle size: 50 μm.
- Specified tap density: 0.4–0.6 g/cm³.
APPLICATION SCOPE: thermal-interface-material research.
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
TAILORED SOLUTIONS FOR RESEARCH
Contact our engineering team for technical support or official institutional quotations.
How does the spherical agglomerated morphology of Atomfair h-BN powder with D50 50 μm affect its packing and thermal performance in thermal interface materials?
The spherical agglomerated morphology, formed from loosely compacted hexagonal boron nitride platelets, provides a tap density of 0.4–0.6 g/cm³, which influences filler loading and thermal conductivity in TIM formulations. The 50 μm D50 particle size is optimized for balancing thermal path formation and viscosity in polymeric matrices.
What is the significance of the 0.10% water-soluble boron content in Atomfair h-BN powder for thermal interface material applications?
The water-soluble boron content is stated as 0.10%, which is a key purity metric for h-BN used in TIMs. Elevated soluble boron can introduce ionic impurities that may affect dielectric properties or long-term reliability in electronic assemblies. This specification ensures low contamination for research-grade TIM development.
What safety and handling documentation is available for Atomfair hexagonal boron nitride powder?
Atomfair provides a Certificate of Analysis (COA) and Safety Data Sheet (SDS) upon request for batch-specific confirmation. As a fine powder, standard precautions for dust inhalation and skin contact should be observed; the SDS contains detailed handling and storage recommendations.
This spherical agglomerated h-BN powder is specified at D50 50 μm with a tap density of 0.4–0.6 g/cm³ and water-soluble boron content of 0.10%, positioning it for thermal-interface-material research where controlled particle morphology and low soluble-boron content are relevant.
Positive
- Spherical agglomerated h-BN morphology: Supplied as loosely compacted hexagonal boron nitride platelets in spherical, layered agglomerates, the powder provides a defined morphology relevant for thermal-interface-material research.
- Controlled D50 and tap density: With a D50 of 50 μm and tap density of 0.4–0.6 g/cm³, the powder offers a specified particle-size and packing range that supports reproducible formulation trials.
Trade-offs
- Loose agglomerate fragility: Because the spheres are loosely compacted platelet agglomerates, mechanical handling or high-shear mixing can break down the agglomerates, altering the effective particle size and packing behavior from the stated D50 and tap density.
- Research-focused application scope: The product is intended for thermal-interface-material research; users must verify suitability for other applications beyond the stated scope.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
