Hexagonal Boron Nitride Powder D50 400 nm ATOMFAIR®

Price range: $179.00 through $299.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Hexagonal boron nitride powder with submicron flake-like morphology, D50 400 nm and 30 m2/g surface area. 250 g or 500 g. For film research.

SKU: AF-FM-C-BNNA-040N-SP00
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Atomfair Hexagonal Boron Nitride (h-BN) Powder, Nanoplatelet Morphology, D50 400 nm



Atomfair Hexagonal Boron Nitride (h-BN) Powder, Nanoplatelet Morphology, D50 400 nm

Product Description

Atomfair hexagonal boron nitride (h-BN) powder is supplied as submicron flake-like particles, with a D50 particle size of 400 nm and a specific surface area of 30 m²/g. It is intended for cosmetic formulations and ultrathin thermally conductive film research.

Technical Specifications

PARAMETER DETAILS
Product Hexagonal Boron Nitride (h-BN) Powder
Chemical Formula BN
Structure / Phase Hexagonal boron nitride (h-BN)
Morphology Submicron flake-like particles
D50 Particle Size 400 nm
Specific Surface Area 30 m2/g
Tap Density 0.4 g/cm3
Water-Soluble Boron 0.10%

Customization & Ordering

Custom specifications, quantities, or packaging may be available upon request. Please submit your target specifications, required quantity, packaging requirements, and delivery timeline through Request a Quote.

Key Features and Advantages

  • Morphology: Submicron flake-like particles.
  • Specified D50 particle size: 400 nm.
  • Specified specific surface area: 30 m²/g.

APPLICATION SCOPE: cosmetic formulations and ultrathin thermally conductive film research.

DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official institutional quotations.

EMAIL: inquiry@atomfair.com



Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

How does the D50 particle size and specific surface area of this h-BN powder benefit ultrathin thermally conductive film research?

The specified D50 of 400 nm and specific surface area of 30 m²/g enable the formation of dense, uniform thin films with high particle packing, which is essential for achieving effective thermal percolation in ultrathin thermally conductive film research. The submicron flake-like morphology further supports in-plane heat spreading, as stated in the product's intended application scope.

What application constraints should be considered when using this h-BN powder in cosmetic formulations?

This h-BN powder is explicitly intended for cosmetic formulations, with a water-soluble boron content of 0.10% as a key purity indicator. While this low boron level is suitable for many cosmetic applications, formulators must verify compliance with regional cosmetic regulations and can request a batch-specific COA to confirm the exact boron content and other parameters.

What safety and quality documentation is available for this h-BN powder, and what does it confirm?

A Safety Data Sheet (SDS) and Certificate of Analysis (COA) can be provided upon request for batch-specific confirmation. The COA verifies the product's key specifications, including D50 particle size, specific surface area, tap density, and water-soluble boron content, while the SDS provides handling, storage, and disposal guidance for the powder.

This Atomfair h-BN powder features submicron platelet morphology with D50 400 nm and specific surface area 30 m²/g, offering high thermal conductivity potential for thin-film composites and smooth texture for cosmetics. The low tap density (0.4 g/cm³) and specified water-soluble boron (0.10%) define its handling and purity profile.

Positive

  • Submicron Platelet Morphology: The submicron flake-like particles (D50 400 nm) with high specific surface area (30 m²/g) enhance thermal interface performance in thin films and provide uniform texture in cosmetic formulations.
  • Low Water-Soluble Boron: Water-soluble boron content is ≤0.10%, indicating controlled purity that minimizes contamination risk in sensitive formulation and research applications.

Trade-offs

  • Low Tap Density Constraints: Tap density of 0.4 g/cm³ suggests poor powder flowability, necessitating careful handling, de-agglomeration, or blending steps in dry processing workflows.
  • Application-Specific Optimization: The submicron size and morphology are optimized for cosmetic and ultrathin thermally conductive film research, limiting direct suitability for bulk structural or high-temperature applications without modification.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

250g, 500g