Beta Silicon Carbide 3C-SiC Powder D50 35μm ATOMFAIR®

Price range: $169.00 through $549.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

3C-SiC beta silicon carbide abrasive powder for precision lapping, with D50 35.0 ± 0.2 μm, D90 55.0 μm, and 1.80 g/cm³ tap density. Order now.

SKU: AF-FM-C-SICW-035W-SP00
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Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 35.0 ± 0.2 μm


Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 35.0 ± 0.2 μm

Product Description

Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) is supplied with a D50 35.0 ± 0.2 μm particle-size specification and high natural bulk density. It is intended for precision grinding, lapping, polishing, and abrasive-processing research.

Technical Specifications
Parameter Specification / Available Values
Product Beta Silicon Carbide Fine Abrasive Powder (3C-SiC)
Material Silicon carbide
Chemical Formula SiC
Crystal Phase / Structure Cubic beta-SiC (3C-SiC)
Basic Grain Content 60%-80%
D10 23.0±0.2 μm
D50 (Median Particle Size) 35.0±0.2 μm
D90 55.0±0.22 μm
D97 ≤68 μm
Tap Density 1.80 ± 0.05 g/cm³ (tap)

Customization & Ordering

Custom particle-size and purity requirements may be evaluated for selected
grades upon request. Alternative package sizes may also be available.
Minimum order quantities, pricing, and lead times vary by specification and
will be confirmed during technical review and quotation.

Key Features and Advantages

  • Defined D50 35.0 ± 0.2 μm particle-size grade.
  • High natural bulk density and efficient abrasive-cutting behavior.
  • Lower processed-surface roughness and improved surface-finish performance.
  • Suitable for controlled grinding, lapping, and polishing evaluation.

APPLICATION SCOPE: precision grinding, lapping, polishing, and abrasive-processing research

DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation. Additional documentation requirements may be discussed before order confirmation.

LABORATORY PROCUREMENT SUPPORT

For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.

E-MAIL: inquiry@atomfair.com


What is the particle size distribution of Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) D50 35.0 ± 0.2 μm and how does it affect polishing performance?

The powder has a tight particle size distribution with D10 = 23.0±0.2 μm, D50 = 35.0±0.2 μm, D90 = 55.0±0.22 μm, and D97 ≤68 μm. This narrow distribution ensures consistent material removal rates and minimizes surface roughness in precision grinding, lapping, and polishing applications, as supported by the product's stated lower processed-surface roughness and improved surface-finish performance.

What are the advantages of using cubic beta-SiC (3C-SiC) over alpha-SiC for precision grinding and polishing?

The Atomfair Beta Silicon Carbide powder is specifically the cubic 3C-SiC phase, which is known for its high natural bulk density and efficient abrasive-cutting behavior. The product description highlights that it achieves lower processed-surface roughness and improved surface-finish performance compared to conventional abrasives, making it particularly suitable for controlled grinding, lapping, and polishing evaluation where surface quality is critical.

Why is the tap density of 1.80 ± 0.05 g/cm³ important for handling and processing this abrasive powder?

The tap density of 1.80±0.05 g/cm³ indicates a high natural bulk density, which directly influences packing efficiency and slurry formulation stability. This property supports efficient abrasive-cutting behavior, as stated in the product description, and ensures consistent performance in precision grinding, lapping, and polishing processes by reducing segregation and improving slurry homogeneity.

This 3C-SiC beta-phase abrasive powder is specified with a D50 of 35.0 ± 0.2 μm and a tap density of 1.80 ± 0.05 g/cm³, supporting controlled grinding, lapping, and polishing research with defined particle-size distribution and high natural bulk density.

Positive

  • Defined D50 particle-size grade: The D50 of 35.0 ± 0.2 μm with D10 23.0±0.2 μm and D90 55.0±0.22 μm provides a tight distribution for reproducible abrasive processing in precision grinding and lapping applications.
  • High natural bulk density: Tap density of 1.80 ± 0.05 g/cm³ supports efficient abrasive-cutting behavior and may contribute to lower processed-surface roughness, improving surface-finish performance in controlled polishing evaluations.

Trade-offs

  • Cubic phase content limitation: Basic grain content is specified at 60%-80%, meaning a portion of the powder may not be pure 3C-SiC, which could affect consistency in applications requiring strict phase purity.
  • Customization requires technical review: Custom particle-size or purity requirements are only evaluated upon request, and minimum order quantities, pricing, and lead times vary by specification, requiring pre-order technical consultation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

1kg, 5kg

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