β-Silicon Carbide 3C-SiC Powder D50 3.5±0.2 μm ATOMFAIR®

Price range: $169.00 through $549.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

3C β-SiC fine abrasive powder with D50 3.5±0.2 μm, D10 1.94±0.3 μm, D90 5.8±0.5 μm and 1.45±0.05 g/cm3 tap density. Order now.

SKU: AF-FM-C-SICW-004W-SP00
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Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 3.5 ± 0.2 μm


Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 3.5 ± 0.2 μm

Product Description

Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) is supplied with a D50 3.5 ± 0.2 μm particle-size specification and high natural bulk density. It is intended for precision grinding, lapping, polishing, and abrasive-processing research.

Technical Specifications
Parameter Specification / Available Values
Product Beta Silicon Carbide Fine Abrasive Powder (3C-SiC)
Material Silicon carbide
Chemical Formula SiC
Crystal Phase / Structure Cubic beta-SiC (3C-SiC)
Basic Grain Content 60%-80%
D10 1.94±0.3 μm
D50 (Median Particle Size) 3.5±0.2 μm
D90 5.8±0.5 μm
D97 ≤7.0 μm
Tap Density 1.45 ± 0.05 g/cm³ (tap)

Customization & Ordering

Custom particle-size and purity requirements may be evaluated for selected
grades upon request. Alternative package sizes may also be available.
Minimum order quantities, pricing, and lead times vary by specification and
will be confirmed during technical review and quotation.

Key Features and Advantages

  • Defined D50 3.5 ± 0.2 μm particle-size grade.
  • High natural bulk density and efficient abrasive-cutting behavior.
  • Lower processed-surface roughness and improved surface-finish performance.
  • Suitable for controlled grinding, lapping, and polishing evaluation.

APPLICATION SCOPE: precision grinding, lapping, polishing, and abrasive-processing research

DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation. Additional documentation requirements may be discussed before order confirmation.

LABORATORY PROCUREMENT SUPPORT

For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.

E-MAIL: inquiry@atomfair.com


How does the narrow particle size distribution (D10=1.94 μm, D50=3.5 μm, D90=5.8 μm) of this beta-SiC powder influence achievable surface finish in lapping applications?

The narrow distribution with D50 3.5 ± 0.2 μm and D97 ≤ 7.0 μm ensures consistent cutting action. The high natural bulk density (tap density 1.45 ± 0.05 g/cm³) and efficient abrasive-cutting behavior contribute to lower processed-surface roughness and improved surface-finish performance, as stated in the product description.

What distinguishes cubic beta-SiC (3C-SiC) from alpha-SiC for precision grinding and polishing of hard materials?

Beta-SiC (3C-SiC) has a cubic crystal structure that provides different fracture characteristics and self-sharpening behavior, which can lead to more efficient cutting and finer finishes. The product's basic grain content is 60%-80%, and it is specifically designed for controlled grinding, lapping, and polishing evaluation.

What batch-specific documentation is available to confirm particle size and purity for this beta-SiC powder?

A Certificate of Analysis (COA) and Safety Data Sheet (SDS) can be provided upon request for batch-specific confirmation of particle size and purity. Additional documentation requirements may be discussed before order confirmation, as noted in the product description.

Atomfair 3C-SiC beta silicon carbide fine abrasive powder is supplied at a D50 of 3.5 ± 0.2 μm with D90 of 5.8 ± 0.5 μm and tap density of 1.45 ± 0.05 g/cm³, and is specified for precision grinding, lapping, polishing, and abrasive-processing research; the combination of controlled particle-size distribution and high bulk density supports surface-finish work with defined cutting behavior.

Positive

  • Controlled abrasive particle-size distribution: D50 of 3.5 ± 0.2 μm, D90 of 5.8 ± 0.5 μm, and D97 ≤7.0 μm define a bounded distribution for precision grinding, lapping, and polishing, supporting lower processed-surface roughness and improved surface finish.
  • High bulk density for cutting performance: Tap density of 1.45 ± 0.05 g/cm³ and high natural bulk density contribute to efficient abrasive-cutting behavior during abrasive-processing research.

Trade-offs

  • Basic grain content specified as a range: Basic grain content is listed as 60%-80%, so the proportion in the primary grain fraction can vary by batch; users requiring a tighter effective grain distribution should request batch-specific COA confirmation.
  • Custom specifications are not guaranteed: Custom particle-size and purity requirements are evaluated only for selected grades upon request, so availability and final specification limits must be confirmed through technical review before ordering.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

1kg, 5kg

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