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Continuous Tin-Plated Copper Foil

Continuous Tin-Plated Copper Foil

$459.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Continuous tin-plated copper foil is a plated conductive foil material with tin layer thickness available from 1 to 5 μm according to customer requirements.

SKU: AF-BM-F-CUTN-PLT1-SN15
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Continuous Tin-Plated Copper Foil

Product Type: Tin-plated copper foil
Research-grade laboratory product

Product Overview

Continuous tin-plated copper foil is a plated conductive foil material with tin layer thickness available from 1 to 5 μm according to customer requirements.

The tin layer protects the copper substrate from oxidation and supports reflow soldering performance while maintaining low surface resistance.

Performance Features
  • Tin purity is specified at ≥99.0% and measured at ≥99.5%.
  • Tin plating thickness can be produced from 1 to 5 μm.
  • Reflow solderability, cross-cut adhesion and alcohol rubbing are marked OK or 5B.
  • Copper can be tin-plated directly or plated with a nickel underlayer before tin plating.

Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-CUTN-1U5U
Tin purity Specification ≥99.0%; measured ≥99.5%
Plating thickness 1-5 μm available according to customer requirement
Reflow solderability OK
Cross-cut adhesion test 5B
Surface resistance Specification ≤30 milliohm; measured 10 milliohm
Surface dyne value Specification ≥38; measured 40
Alcohol rubbing OK at 500 g
Corrosion resistance OK at room temperature, 5% NaCl, pH 7 for 12 hours

Selection and Configuration
Plating route Direct tin plating on copper or nickel underlayer before tin plating
Tin layer thickness 1-5 μm
Quotation Confirmation: Confirm base copper foil and required tin layer thickness.
Specification Confirmation: Confirm whether direct tin plating or nickel-underlayer tin plating is required.
Configuration Support: Reflow solderability and corrosion-resistance requirements should be confirmed with layer design.
Quotation Note: Include base foil, plating route, tin thickness and quantity for quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
E-MAIL: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

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