Atomfair Tantalum Nitride (TaN) Powder, 99.9% Purity, −325 Mesh, 23.38 μm APS
Product Description
Atomfair tantalum nitride (TaN) is supplied as black crystalline powder with 99.9% purity and a -325 mesh (23.38 μm APS) particle specification; custom mesh specifications may be available upon request. It is intended for copper diffusion-barrier and adhesion-layer research in integrated-circuit fabrication, and thin-film resistor research.
Technical Specifications
| Parameter | Specification / Available Values |
|---|---|
| Product | Tantalum Nitride (TaN) Powder |
| Chemical Formula | TaN |
| CAS Number | 12033-62-4 |
| Purity | 99.9% |
| Particle Specification | -325 mesh (23.38 μm APS); custom mesh specifications may be available upon request. |
| Physical State | Powder |
| Appearance | Black crystalline powder |
Customization & Ordering
Alternative purity, particle-size, and package requirements may be evaluated upon request. Minimum order quantities, pricing, and lead times are confirmed during quotation.
Key Features and Advantages
- Source-listed purity of 99.9% with a -325 mesh (23.38 μm APS) particle specification; custom mesh specifications may be available upon request.
- Powder format for copper diffusion-barrier and adhesion-layer research in integrated-circuit fabrication, and thin-film resistor research.
APPLICATION SCOPE: copper diffusion-barrier and adhesion-layer research in integrated-circuit fabrication, and thin-film resistor research
DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation.
LABORATORY PROCUREMENT SUPPORT
For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.
This powder is intended for copper diffusion-barrier and adhesion-layer research in integrated-circuit fabrication, and thin-film resistor research. It requires controlled storage to prevent moisture uptake and oxidation that could compromise thin-film deposition quality.
- Moisture Sensitivity: Store in a dry, inert atmosphere to prevent hydrolysis or oxidation of the powder surface.
- Particle Size Integrity: Avoid mechanical compaction or excessive vibration that could alter the -325 mesh particle size distribution.
- Contamination Control: Handle in a cleanroom environment to prevent particulate contamination that could affect thin-film uniformity.
This procedure describes the safe handling and preparation of TaN powder for sputtering target fabrication or direct evaporation. It assumes use in a controlled laboratory environment with appropriate personal protective equipment.
Required Equipment: Inert-atmosphere glovebox, Cleanroom-grade spatula, Vacuum-sealable container
- Prepare Glovebox Environment
Purge the glovebox with argon or nitrogen to maintain oxygen and moisture levels below 1 ppm. - Weigh Required Quantity
Transfer the powder into a clean, pre-weighed container using a cleanroom-grade spatula inside the glovebox. - Seal Container
Vacuum-seal the container immediately after weighing to prevent atmospheric exposure during transfer. - Load Deposition System
Transfer the sealed container to the sputtering or evaporation system and load the powder into the target holder under vacuum. - Verify Deposition Parameters
Confirm that the chamber pressure and substrate temperature are within the specified range for TaN thin-film growth.
What is the typical particle size distribution and purity of Atomfair TaN powder for copper diffusion-barrier research?
Atomfair tantalum nitride (TaN) powder is supplied with a guaranteed purity of 99.9% and a particle specification of -325 mesh, corresponding to a mean particle size (APS) of 23.38 μm. The powder is black crystalline and intended for copper diffusion-barrier and adhesion-layer research in integrated-circuit fabrication, as well as thin-film resistor research.
Can Atomfair TaN powder be supplied with custom particle size or purity for specific thin-film deposition requirements?
Yes, custom mesh specifications, alternative purity levels, and package sizes may be evaluated upon request. The product description explicitly states that custom mesh specifications may be available, and alternative purity and particle-size requirements are assessed during quotation. This flexibility supports specialized research needs in copper diffusion-barrier and adhesion-layer studies.
What documentation is available for batch-specific confirmation of TaN powder composition and handling safety?
A Certificate of Analysis (COA) and Safety Data Sheet (SDS) can be provided upon request for batch-specific confirmation of the 99.9% purity and material properties. These documents are essential for verifying composition in integrated-circuit fabrication research and for ensuring safe handling of the black crystalline powder in laboratory environments.
Atomfair tantalum nitride (TaN) powder with 99.9% purity and -325 mesh (23.38 μm APS) is evaluated for use in copper diffusion-barrier and adhesion-layer research, and thin-film resistor applications. The controlled particle size and high purity support reproducible thin-film deposition studies.
Positive
- High purity and controlled particle size: 99.9% purity and -325 mesh (23.38 μm APS) ensure consistent material properties for research applications.
- Application-specific formulation: Designed for copper diffusion-barrier and adhesion-layer research in integrated-circuit fabrication, and thin-film resistor research.
Trade-offs
- Documentation upon request only: Batch-specific COA and SDS are not automatically included with the product and must be requested separately for quality assurance.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
