β-Silicon Carbide 3C-SiC Powder D50 6.5±0.3 μm ATOMFAIR®

Price range: $169.00 through $549.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Beta 3C-SiC abrasive powder with D50 6.5±0.3 μm, D90 10.3±0.8 μm and 1.64±0.05 g/cm3 tap density for lapping and polishing. Order now.

SKU: AF-FM-C-SICW-006W-SP00
Category:
Brands:






Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 6.5 ± 0.3 μm


Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC), D50 6.5 ± 0.3 μm

Product Description

Atomfair Beta Silicon Carbide Fine Abrasive Powder (3C-SiC) is supplied with a D50 6.5 ± 0.3 μm particle-size specification and high natural bulk density. It is intended for precision grinding, lapping, polishing, and abrasive-processing research.

Technical Specifications
Parameter Specification / Available Values
Product Beta Silicon Carbide Fine Abrasive Powder (3C-SiC)
Material Silicon carbide
Chemical Formula SiC
Crystal Phase / Structure Cubic beta-SiC (3C-SiC)
Basic Grain Content 60%-80%
D10 4.1±0.15 μm
D50 (Median Particle Size) 6.5±0.3 μm
D90 10.3±0.8 μm
D97 ≤11.2 μm
Tap Density 1.64 ± 0.05 g/cm³ (tap)

Customization & Ordering

Custom particle-size and purity requirements may be evaluated for selected
grades upon request. Alternative package sizes may also be available.
Minimum order quantities, pricing, and lead times vary by specification and
will be confirmed during technical review and quotation.

Key Features and Advantages

  • Defined D50 6.5 ± 0.3 μm particle-size grade.
  • High natural bulk density and efficient abrasive-cutting behavior.
  • Lower processed-surface roughness and improved surface-finish performance.
  • Suitable for controlled grinding, lapping, and polishing evaluation.

APPLICATION SCOPE: precision grinding, lapping, polishing, and abrasive-processing research

DOCUMENTATION: COA and SDS can be provided upon request for batch-specific confirmation. Additional documentation requirements may be discussed before order confirmation.

LABORATORY PROCUREMENT SUPPORT

For grade selection, particle-size confirmation, documentation support or custom specification review, contact our technical sales team.

E-MAIL: inquiry@atomfair.com


What is the significance of the D50 particle size of 6.5 ± 0.3 μm in this beta-SiC abrasive powder for precision lapping?

The D50 of 6.5 ± 0.3 μm defines the median particle size, enabling controlled material removal and surface finish. The narrow distribution (D10 4.1±0.15 μm, D90 10.3±0.8 μm, D97 ≤11.2 μm) minimizes oversize particles that could cause deep scratches. A tap density of 1.64 ± 0.05 g/cm³ indicates high bulk density, which improves slurry stability and cutting efficiency during lapping and polishing.

Can this cubic beta-SiC (3C-SiC) powder be used for polishing hard materials like semiconductor substrates or ceramics?

Yes, this beta-SiC powder is intended for precision grinding, lapping, and polishing research. Its cubic phase (3C-SiC) is known for high hardness and chemical inertness, making it suitable for finishing hard materials such as silicon carbide, sapphire, and advanced ceramics. The specified particle size and high tap density further support consistent abrasive action in controlled lab applications.

How does the basic grain content of 60%-80% affect the abrasive performance of this beta-SiC powder?

The basic grain content of 60%-80% represents the fraction of single-crystal particles. Higher single-crystal content typically enhances cutting efficiency and consistency, while the remaining fraction may include polycrystalline or agglomerated particles. This balance is specified to achieve a compromise between material removal rate and surface finish quality in precision lapping and polishing applications.

Atomfair's 3C-SiC abrasive powder with D50 6.5 ± 0.3 μm offers a well-defined median particle size and high tap density for precision grinding, lapping, and polishing studies; its practical deployment depends on confirming batch-specific documentation and requesting any custom grade adjustments in advance.

Positive

  • Defined D50 6.5 μm particle size: D50 is tightly specified at 6.5 ± 0.3 μm with D10, D90, and D97 limits, giving the powder a controlled distribution appropriate for precision grinding, lapping, polishing, and abrasive-processing research.
  • High tap density for finishing: Tap density of 1.64 ± 0.05 g/cm³ is combined with high natural bulk density and efficient abrasive-cutting behavior; the product is stated to provide lower processed-surface roughness and improved surface-finish performance.

Trade-offs

  • Custom specifications limited to selected grades: Particle-size and purity modifications are evaluated only for selected grades upon request, so non-standard specifications must be confirmed through technical review before order placement rather than assumed available.
  • Batch documentation is request-only: COA and SDS are not described as auto-issued; they are supplied upon request for batch-specific confirmation, with any additional documentation requirements discussed before order confirmation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Package

1kg, 5kg

Related Products